Zxms6004ff, Functional block diagram, Maximum ratings – Diodes ZXMS6004FF User Manual

Page 2: Thermal characteristics

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ZXMS6004FF

Document number: DS33609 Rev. 5 - 2

2 of 8

www.diodes.com

March 2014

© Diodes Incorporated

ZXMS6004FF

IntelliFET is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide.



Functional Block Diagram

Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Continuous Drain-Source Voltage

V

DS

60 V

Drain-Source Voltage for Short Circuit Protection

V

DS(SC)

36 V

Continuous Input Voltage

V

IN

-0.5 to +6

V

Continuous Input Current @-0.2V ≤ V

IN

≤ 6V

Continuous Input Current @V

IN

< -0.2V or V

IN

> 6V

I

IN

No limit

│I

IN

│≤2

mA

Pulsed Drain Current @V

IN

= 3.3V

I

DM

2 A

Pulsed Drain Current @V

IN

= 5V

I

DM

2.5 A

Continuous Source Current (Body Diode) (Note 5)

I

S

1 A

Pulsed Source Current (Body Diode)

I

SM

5 A

Unclamped Single Pulse Inductive Energy,
T

J

= +25°C, I

D

= 0.5A, V

DD

= 24V

E

AS

90 mJ

Electrostatic Discharge (Human Body Model)

V

ESD

4000 V

Charged Device Model

V

CDM

1000 V


Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Power Dissipation at T

A

= +25°C (Note 5)

Linear Derating Factor

P

D

0.83
6.66

W

mW/°C

Power Dissipation at T

A

= +25°C (Note 6)

Linear Derating Factor

P

D

1.5

12.0

W

mW/°C

Thermal Resistance, Junction to Ambient (Note 5)

R

θJA

150

C/W

Thermal Resistance, Junction to Ambient (Note 6)

R

θJA

83 °C/W

Thermal Resistance, Junction to Case (Note 7)

R

θJC

44 °C/W

Operating Temperature Range

T

J

-40 to +150

°C

Storage Temperature Range

T

STG

-55 to +150

°C

Notes:

5. For a device surface mounted on 15mm x 15mm single sided 1oz weight copper on 1.6mm FR4 board, in still air conditions.

6. For a device surface mounted on 50mm x 50mm single sided 2oz weight copper on 1.6mm FR4 board, in still air conditions.

7. Thermal resistance from junction and the mounting surfaces of the drain pins.




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