Maximum ratings, Thermal characteristics – Diodes ZXMS6006SG User Manual

Page 3

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ZXMS6006SG

Document number: DS35141 Rev. 2 - 2

3 of 9

www.diodes.com

November 2011

© Diodes Incorporated

ZXMS6006SG

ADVAN

CE I

N

F

O

RM

ATI

O

N

A Product Line of

Diodes Incorporated

IntelliFET

®

is a trademark of Diodes Incorporated, registered in the United States and other jurisdictions worldwide.





Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Continuous Drain-Source Voltage

V

DS

60 V

Drain-Source Voltage for short circuit protection

V

DS(SC)

16 V

Continuous Input Voltage

V

IN

-0.5 ... +6

V

Continuous Input Current @-0.2V

≤ V

IN

≤ 6V

Continuous Input Current @V

IN

< -0.2V or V

IN

> 6V

I

IN

No limit

│I

IN

│≤2

mA

Pulsed Drain Current @V

IN

= 3.3V

I

DM

11 A

Pulsed Drain Current @V

IN

= 5V

I

DM

13 A

Continuous Source Current (Body Diode) (Note 4)

I

S

2 A

Pulsed Source Current (Body Diode)

I

SM

12 A

Unclamped Single Pulse Inductive Energy,
T

J

= 25

°C, I

D

= 0.5A, V

DD

= 24V

E

AS

480 mJ

Electrostatic Discharge (Human Body Model)

V

ESD

4000 V

Charged Device Model

V

CDM

1000 V




Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Power Dissipation at T

A

= 25

°C (Note 4)

Linear Derating Factor

P

D

1.0
8.0

W

mW/

°C

Power Dissipation at T

A

= 25

°C (Note 5)

Linear Derating Factor

P

D

1.6

12.8

W

mW/

°C

Thermal Resistance, Junction to Ambient (Note 4)

R

θJA

125

°C/W

Thermal Resistance, Junction to Ambient (Note 5)

R

θJA

83

°C/W

Thermal Resistance, Junction to Case (Note 6)

R

θJC

39

°C/W

Operating Temperature Range

T

J

-40 to +150

°C

Storage Temperature Range

T

STG

-55 to +150

°C

Notes:

4. For a device surface mounted on 15mm x 15mm single sided 1oz weight copper on 1.6mm FR4 board, in still air conditions. Sink split drain 80% and

source 20% to isolate connections.

5. For a device surface mounted on 50mm x 50mm single sided 2oz weight copper on 1.6mm FR4 board, in still air conditions. Sink split drain 80% and

source 20% to isolate connections.

6. Thermal resistance between junction and the mounting surfaces of drain and source pins.


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