Diodes ZXMHC6A07N8 - Manual (Page 2)

ZXMHC6A07N8
Issue 1.0 - March 2009 2
© Diodes Incorporated
www.diodes.com
Absolute maximum ratings
Parameter Symbol N-
channel
P-
channel
Unit
Drain-Source voltage V
DSS 60 -60 V
Gate-Source voltage V
GS
±20 ±20 V
Continuous Drain current @ V
GS
= 10V; T
A
=25
°C
(b)
@ V
GS
= 10V; T
A
=70
°C
(b)
@ V
GS
= 10V; T
A
=25
°C
(a)
@ V
GS
= 10V; T
L
=25
°C
(f)
I
D
1.80
1.40
1.39
1.42
-1.42
-1.28
-1.28
-1.33
A
Pulsed Drain current @ V
GS
= 10V; T
A
=25
°C
(c)
I
DM 7.10 -6.03 A
Continuous Source current (Body diode) at T
A
=25
°C
(b)
I
S
1.00 -1.00 A
Pulsed Source current (Body diode) at T
A
=25
°C
(c)
I
SM
7.10 -6.03 A
Power dissipation at T
A
=25
°C
(a)
Linear derating factor
P
D
0.87
6.94
W
mW/
°C
Power dissipation at T
A
=25
°C
(b)
Linear derating factor
P
D
1.36
10.9
W
mW/
°C
Power dissipation at T
L
=25
°C
(f)
Linear derating factor
P
D
0.90
7.19
W
mW/
°C
Operating and storage temperature range T
j
, T
stg -55 to 150
°C
Thermal resistance
Parameter Symbol Value Unit
Junction to ambient
(a)
R θJA 144
°C/W
Junction to ambient
(b)
R θJA 92 °C/W
Junction to ambient
(d)
R θJA 106
°C/W
Junction to ambient
(e)
R θJA 254 °C/W
Junction to lead
(f)
R θJL 139
°C/W
NOTES:
(a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still
air conditions with the heat-sink split into two equal areas (one for each drain connection); the device is measured when
operating in a steady-state condition with one active die.
(b) Same as note (a), except the device is measured at t
≤ 10 sec.
(c) Same as note (a), except the device is pulsed with D= 0.02 and pulse width 300 µs. The pulse current is limited by the
maximum junction temperature.
(d) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still
air conditions with the heat-sink split into two equal areas (one for each drain connection); the device is measured when
operating in a steady-state condition with one active die.
(e) For a device surface mounted on minimum copper 1.6mm FR4 PCB, in still air conditions; the device is measured when
operating in a steady-state condition with one active die.
(f) Thermal resistance from junction to solder-point (at the end of the drain lead); the device is operating in a steady-state
condition with one active die.