Package outline - sm-8 soldering footprint, Zmt32 – Diodes ZMT32 User Manual

Page 9

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ZMT32

Issue 1 - June 2008

9

www.zetex.com

© Zetex Semiconductors plc 2008

Package outline - SM-8

Soldering footprint

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

DIM

Millimeters

Inches

DIM

Millimeters

Inches

Min.

Max.

Typ.

Min.

Max.

Typ.

Min.

Max.

Typ.

Min.

Max.

Typ.

A

-

1.7

-

-

0.067

-

e1

-

-

4.59

-

-

0.1807

A1

0.02

0.1

-

0.0008

0.004

-

e2

-

-

1.53

-

-

0.0602

b

-

-

0.7

-

-

0.0275

He

6.7

7.3

-

0.264

0.287

-

c

0.24

0.32

-

0.009

0.013

-

Lp

0.9

-

-

0.035

-

-

D

6.3

6.7

-

0.248

0.264

-

-

15°

-

-

15°

-

E

3.3

3.7

-

0.130

0.145

-

-

-

10°

-

-

10°

2.8

0.110

6.8

0.268

4.6

0.181

0.95

0.037

1.52

0.060

mm

inches

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