Diodes DCX (LO-R1) H User Manual

Dcx (lo-r1) h, Cxxym, Features

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DS30429 Rev. 3 - 2

1 of 4

www.diodes.com

DCX (LO-R1) H

© Diodes Incorporated

DCX (LO-R1) H

DCX (LO-R1) H

COMPLEMENTARY NPN/PNP PRE-BIASED SMALL SIGNAL DUAL SURFACE MOUNT TRANSISTOR

Features

Epitaxial Planar Die Construction

Built-In Biasing Resistors

Lead Free By Design/RoHS Compliant (Note 3)

"Green" Device (Note 4 and 5)

Mechanical Data

Case: SOT-563

Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208

Terminal Connections: See Diagram

Weight: 0.005 grams (approximate)



P/N

R1 (NOM)

R2 (NOM)

MARKING

DCX122LH
DCX142JH
DCX122TH
DCX142TH

0.22K

Ω

0.47K

Ω

0.22K

Ω

0.47K

Ω

10K

Ω

10K

Ω

OPEN
OPEN

C81
C82
C83
C84






N

E

P

D

UC

P

D

UC

W

R

O

T

T

R

O

SOT-563

Dim

Min Max Typ

A

0.15

0.30 0.25

B

1.10

1.25 1.20

C

1.55

1.70 1.60

D

0.50

G

0.90

1.10 1.00

H

1.50

1.70 1.60

K

0.56

0.60 0.60

L

0.15

0.25 0.20

M

0.10

0.18 0.11

All Dimensions in mm

A

M

L

Maximum Ratings NPN Section

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Supply Voltage

V

CC

50

V

Input Voltage

DCX122LH

DCX142JH

V

IN

-5 to +6
-5 to +6

V

Input Voltage DCX122TH
DCX142TH

V

EBO (MAX)

5

V

Output Current All

I

C

100

mA

Power Dissipation (Note 1, 2)

P

d

150

mW

Thermal Resistance, Junction to Ambient Air (Note 1)

R

θJA

833

°C/W

Operating and Storage Temperature Range

T

j

, T

STG

-55 to +150

°C

Notes:

1. Mounted on FR4 PC Board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
2. NPN Section, PNP Section, or maximum combined.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.





R

1

, R

2

R

1

Only

SCHEMATIC DIAGRAM, TOP VIEW

R

1

R

1

R

1

R

1

R

2

R

2

B C

H

K

G

D

CXXYM

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