Package outline dimensions, Suggested pad layout – Diodes B170_B - B1100_B User Manual
Page 3
B170/B - B1100/B
Document number: DS30018 Rev. 10 - 2
3 of 4
September 2010
© Diodes Incorporated
B170/B - B1100/B
0
0.5
1.0
25
50
75
100
125
150
I A
V
E
R
A
G
E
F
O
R
WA
R
D
C
U
R
R
EN
T
(A
)
F(
A
V
),
T , TERMINAL TEMPERATURE ( C)
Fig. 3 Forward Current Derating Curve
T
°
10
20
30
40
0
1
10
100
I,
P
EAK
F
O
R
WA
R
D S
U
R
G
E
C
U
R
R
E
N
T
(A
)
FS
M
NUMBER OF CYCLES AT 60 Hz
Fig. 4 Max Non-Repetitive Peak Forward Surge Current
Single Half Sine-Wave
T = 150 C
J
°
Package Outline Dimensions
Suggested Pad Layout
SMB
Dim
Min
Max
A
3.30
3.94
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
E
5.00
5.59
G
0.05
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
SMA
Dim
Min
Max
A
2.29
2.92
B
4.00
4.60
C
1.27
1.63
D
0.15
0.31
E
4.80
5.59
G
0.05
0.20
H
0.76
1.52
J
2.01
2.30
All Dimensions in mm
SMA
Dimensions
Value (in mm)
Z
6.5
G
1.5
X
1.7
Y
2.5
C
4.0
SMB
Dimensions
Value (in mm)
Z
6.7
G
1.8
X
2.3
Y
2.5
C
4.3
A
B
C
D
G
H
E
J