Package outline dimensions, Suggested pad layout, Dmg6968uts – Diodes DMG6968UTS User Manual
Page 5
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DMG6968UTS
Document number: DS31793 Rev. 5 - 2
5 of 6
March 2012
© Diodes Incorporated
DMG6968UTS
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
Fig. 13 Transient Thermal Response
t , PULSE DURATION TIME (s)
1
T - T = P * R
(t)
Duty Cycle, D = t /t
J
A
JA
1 2
θ
R
(t) = r(t) *
θJA
R
R
= 157°C/W
θ
θ
JA
JA
P(pk)
t
1
t
2
0.001
0.01
0.1
1
r(
t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
D = 0.7
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
D = 0.9
D = 0.5
Package Outline Dimensions
Suggested Pad Layout
TSSOP-8L
Dim
Min Max Typ
a
0.09
−
−
A
−
1.20
−
A1
0.05 0.15
−
A2 0.825 1.025 0.925
b
0.19 0.30
−
c
0.09 0.20
−
D
2.90 3.10 3.025
e
−
−
0.65
E
−
−
6.40
E1
4.30 4.50 4.425
L
0.45 0.75 0.60
All Dimensions in mm
Dimensions Value (in mm)
X
0.45
Y
1.78
C1
7.72
C2
0.65
C3
4.16
G
0.20
L
Gauge plane
See Detail C
D
E
A1
A2
A
e
a
Detail C
E1
b
D
c
Y
C3
C1
X
C2
G