Diodes DMN2400UV - Manual (Page 2)

DMN2400UV
Document number: DS31852 Rev. 7 - 2
2 of 6
www.diodes.com
January 2011
© Diodes Incorporated
DMN2400UV
Maximum Ratings
@T A = 25°C unless otherwise specified
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
20 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 4)
Steady
State
T
A
= 25
°C
T
A
= 85
°C
I
D
1.33
0.84
A
Pulsed Drain Current I DM
3 A
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Units
Total Power Dissipation (Note 4) P
D
530 mW
Thermal Resistance, Junction to Ambient R θJA 233.8 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
BV
DSS
20 - - V V
GS
= 0V, I
D
= 250 μA
Zero Gate Voltage Drain Current T
J
= 25°C I
DSS
- - 100 nA V
DS
= 20V, V
GS
= 0V
Gate-Source Leakage I
GSS
- - ±1.0
μA
V
GS
= ±4.5V, V
DS
= 0V
- - ±50 V
GS
= ±10V, V
DS
= 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(th)
0.5 - 0.9 V V
DS
= V
GS
, I
D
= 250 μA
Static Drain-Source On-Resistance R
DS (ON)
- 0.3 0.48
Ω
V
GS
= 5.0V, I
D
= 200mA
- 0.35 0.5 V
GS
= 4.5V, I
D
= 600mA
- 0.45 0.7 V
GS
= 2.5V, I
D
= 500mA
- 0.55 0.9 V
GS
= 1.8V, I
D
= 350mA
- 0.65 1.5 V
GS
= 1.5V, I
D
= 50mA
Forward Transfer Admittance |Y fs | - 1.4 - S V DS = 10V, I D = 400mA
Diode Forward Voltage (Note 5) V
SD
0.7 1.2 V
V
GS
= 0V, I
S
= 150mA,
f = 1.0MHz
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
C
iss
- 36.0 - pF
V
DS
=16V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
- 5.7 - pF
Reverse Transfer Capacitance C
rss
- 4.2 - pF
Gate Resistance R
g
- 68 - Ω V
DS
= 0V, V
GS
= 0V,
Total Gate Charge Q
g
- 0.5 - nC V
GS
=4.5V, V
DS
= 10V,
I D =250mA Gate-Source Charge Q
gs
- 0.07 - nC
Gate-Drain Charge Q
gd
- 0.1 - nC
Turn-On Delay Time t
D(on)
- 4.06 - ns
V
DD
= 10V, V
GS
= 4.5V,
R
L
= 47 Ω, R
G
= 10 Ω,
I
D
= 200mA
Turn-On Rise Time t r
- 7.28 - ns
Turn-Off Delay Time t
D(off)
- 13.74 - ns
Turn-Off Fall Time t
f
- 10.54 - ns
Notes: 4. Device soldered onto FR-4 PCB, minimum recommended soldering pad dimensions (25.4mm x 25.4mm x1.6mm, 2oz Cu pad: 0.18mm 2 x 6).
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.