Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN2500UFB4 User Manual

Page 2

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DMN2500UFB4

Document number: DS35724 Rev. 3 - 2

2 of 5

www.diodes.com

March 2012

© Diodes Incorporated

DMN2500UFB4

ADVAN

CE I

N

F

O

RM

ATI

O

N




Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

20 V

Gate-Source Voltage

V

GSS

±6 V

Continuous Drain Current (Note 4) V

GS

= 4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

810
640

mA

t<10s

T

A

= 25°C

T

A

= 70°C

I

D

950
750

mA

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

1000

800

mA

t<10s

T

A

= 25°C

T

A

= 70°C

I

D

1200
1000

mA

Pulsed Drain Current (10

μs pulse, duty cycle = 1%)

I

DM

4 A

Maximum Body Diode continuous Current

I

S

850 mA


Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 4)

T

A

= 25°C

P

D

0.46

W

T

A

= 70°C

0.29

Thermal Resistance, Junction to Ambient (Note 4)

Steady state

R

θJA

279 °C/W

t<10s 210

°C/W

Total Power Dissipation (Note 5)

T

A

= 25°C

P

D

0.95

W

T

A

= 70°C

0.6

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

R

θJA

134 °C/W

t<10s 100

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C


Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

20 - - V

V

GS

= 0V, I

D

= 250

μA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- -

100

nA

V

DS

= 20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±1.0

μA

V

GS

= ±4.5V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

0.5 - 1.0 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

-

0.3 0.4

Ω

V

GS

= 4.5V, I

D

= 600mA

0.4 0.5

V

GS

= 2.5V, I

D

= 500mA

0.5 0.7

V

GS

= 1.8V, I

D

= 350mA

Forward Transfer Admittance

|Y

fs

|

- 1.4 - S

V

DS

= 10V, I

D

= 400mA

Diode Forward Voltage

V

SD

0.7

1.2

V

V

GS

= 0V, I

S

= 150mA

DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance

C

iss

- 60.67 -

pF

V

DS

=16V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 9.68 - pF

Reverse Transfer Capacitance

C

rss

- 5.37 - pF

Gate resistance

R

g

- 93 - Ω

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge

Q

g

- 736.6 -

pC

V

GS

= 4.5V, V

DS

= 10V,

I

D

= 250mA

Gate-Source Charge

Q

gs

- 93.6 - pC

Gate-Drain Charge

Q

gd

- 116.6 -

pC

Turn-On Delay Time

t

D(on)

-

5.1

- ns

V

DD

= 10V, V

GS

= 4.5V,

R

L

= 47

Ω, R

G

= 10

Ω,

I

D

= 200mA

Turn-On Rise Time

t

r

-

7.4

- ns

Turn-Off Delay Time

t

D(off)

-

26.7

- ns

Turn-Off Fall Time

t

f

-

12.3

- ns

Notes:

4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.


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