Dmn313dlt new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN313DLT User Manual

Page 2: Electrical characteristics, Dmn313dlt

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DMN313DLT

Document number: DS35078 Rev. 2 - 2

2 of 5

www.diodes.com

August 2011

© Diodes Incorporated

DMN313DLT

NEW PROD

UC

T

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 4) V

GS

= 4.0V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

0.27
0.21

A

Continuous Drain Current (Note 5) V

GS

= 4.0V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

0.31
0.25

A

Continuous Drain Current (Note 5) V

GS

= 4.0V

t

≤ 10s

T

A

= 25°C

T

A

= 70°C

I

D

0.38

0.3

A

Continuous Drain Current (Note 4) V

GS

= 2.5V

Steady

State

T

A

= 25°C

T

A

= 70°C

I

D

0.21
0.15

A

Continuous Drain Current (Note 5) V

GS

= 2.5V

t

≤ 10s

T

A

= 25°C

T

A

= 70°C

I

D

0.29
0.22

A

Pulsed Drain Current (Note 6)

I

DM

1.2 A


Thermal Characteristics

Characteristic Symbol

Max

Unit

Power Dissipation (Note 4)

P

D

0.28 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 4)

R

θJA

474 °C/W

Power Dissipation (Note 5)

P

D

0.36 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 5)

R

θJA

361 °C/W

Power Dissipation (Note 5) t

≤ 10s

P

D

0.52 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 5) t

≤ 10s R

θJA

252 °C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C


Electrical Characteristics

@ T

A

= 25°C unless otherwise stated

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

30 - - V

V

GS

= 0V, I

D

= 250

μA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- -

0.1

μA

V

DS

= 30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±1.0

μA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

0.5 - 1.5 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

- 1.3 2

Ω

V

GS

= 4V, I

D

= 10mA

- 1.6

3.2

V

GS

= 2.5V, I

D

= 1mA

Forward Transfer Admittance

|Y

fs

|

- 93 - mS

V

DS

= 3V, I

D

= 10mA

Diode Forward Voltage

V

SD

- 0.7

1.3 V

V

GS

= 0V, I

S

= 115mA

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

- 36.3 -

pF

V

DS

= 5V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 7.6 -

Reverse Transfer Capacitance

C

rss

- 4.7 -

Gate Resistance

R

g

- 128 - Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge

Q

g

- 0.5 -

nC

V

GS

= 4.5V, V

DS

= 15V,

I

D

= 10mA

Gate-Source Charge

Q

gs

- 0.1 -

Gate-Drain Charge

Q

gd

- 0.1 -

Turn-On Delay Time

t

D(on)

- 4.5 - ns

V

GS

= 4.5V, V

DS

= 15V,

R

G

= 2

Ω,

I

D

= 180mA

Turn-On Rise Time

t

r

- 2.24 - ns

Turn-Off Delay Time

t

D(off)

- 19.2 - ns

Turn-Off Fall Time

t

f

- 28.2 - ns

Notes:

4. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.

5. Device mounted on 2” x 2” FR-4 PCB with high coverage 2 oz. Copper, single sided.

6. Repetitive rating, pulse width limited by junction temperature.

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to production testing.



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