Dmb53d0uv, Maximum ratings – mosfet, q1, Maximum ratings - npn transistor, q2 – Diodes DMB53D0UV User Manual

Page 2: Thermal characteristics, total device, Electrical characteristics - mosfet

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DMB53D0UV

Document number: DS31651 Rev. 7 - 2

2 of 7

www.diodes.com

March 2012

© Diodes Incorporated

DMB53D0UV





Maximum Ratings – MOSFET, Q1

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

50 V

Gate-Source Voltage

V

GSS

±12

V

Drain Current (Note 4)

Continuous

I

D

160 mA

Pulsed Drain Current (Note 4)

I

DM

560 mA





Maximum Ratings - NPN Transistor, Q2

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Collector-Base Voltage

V

CBO

50 V

Collector-Emitter Voltage

V

CEO

45 V

Emitter-Base Voltage

V

EBO

6.0 V

Collector Current

I

C

100 mA





Thermal Characteristics, Total Device

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Total Power Dissipation (Note 1)

P

D

250 mW

Thermal Resistance, Junction to Ambient (Note 1)

R

θJA

500

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-55 to +150

°C







Electrical Characteristics - MOSFET

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage

BV

DSS

50

V

V

GS

= 0V, I

D

= 250

μA

Zero Gate Voltage Drain Current

I

DSS

10

μA

V

DS

= 50V, V

GS

= 0V

Gate-Body Leakage

I

GSS

1.0

5.0

μA

V

GS

=

±8V, V

DS

= 0V

V

GS

=

±12V, V

DS

= 0V

ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage

V

GS(th)

0.7 0.8 1.0 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

3.1 4 Ω

V

GS

= 4V, I

D

= 100mA

4 5

V

GS

= 2.5V, I

D

= 80mA

Forward Transconductance

g

FS

180

mS

V

DS

= 10V, I

D

= 100mA,

f = 1.0KHz

DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance

C

iss

25

pF

V

DS

= 10V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

5

pF

Reverse Transfer Capacitance

C

rss

2.1

pF

Notes:

4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.

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