Dmn5l06dwk new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMN5L06DWK User Manual

Page 2: Electrical characteristics

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DMN5L06DWK

Document number: DS30930 Rev. 5 - 2

2 of 6

www.diodes.com

September 2011

© Diodes Incorporated

DMN5L06DWK

NEW PROD

UC

T

Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Drain Source Voltage

V

DSS

50 V

Gate-Source Voltage

V

GSS

±20

V

Drain Current (Note 4)

Continuous

Pulsed (Note 5)

I

D

305
800

mA




Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Total Power Dissipation (Note 4)

P

D

250 mW

Thermal Resistance, Junction to Ambient

R

θJA

500

°C/W

Operating and Storage Temperature Range

T

J

, T

STG

-65 to +150

°C




Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

BV

DSS

50

V

V

GS

= 0V, I

D

= 10

μA

Zero Gate Voltage Drain Current

@ T

C

= 25°C

I

DSS

60 nA

V

DS

= 50V, V

GS

= 0V

Gate-Body Leakage

I

GSS

1

500

50

μA
nA
nA

V

GS

= ±12V, V

DS

= 0V

V

GS

= ±10V, V

DS

= 0V

V

GS

= ±5V, V

DS

= 0V

ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage

V

GS(th)

0.49

1.0 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)





3.0
2.5
2.0

Ω

V

GS

= 1.8V, I

D

= 50mA

V

GS

= 2.5V, I

D

= 50mA

V

GS

= 5.0V, I

D

= 50mA

On-State Drain Current

I

D(ON)

0.5 1.4

A

V

GS

= 10V, V

DS

= 7.5V

Forward Transconductance

|Y

fs

|

200

mS

V

DS

=10V, I

D

= 0.2A

Source-Drain Diode Forward Voltage

V

SD

0.5

1.4 V

V

GS

= 0V, I

S

= 115mA

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

50 pF

V

DS

= 25V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

25 pF

Reverse Transfer Capacitance

C

rss

5.0 pF

Notes:

4. Device mounted on FR-4 PCB.

5. Pulse width

≤10μS, Duty Cycle ≤1%.

6. Short duration pulse test used to minimize self-heating effect.



















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