Package outline dimensions, Suggested pad layout – Diodes DMN6075S User Manual
Page 5
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DMN6075S
Document number: DS37023 Rev. 2 - 2
5 of 6
April 2014
© Diodes Incorporated
DMN6075S
ADVAN
CE I
N
F
O
RM
ATI
O
N
Package Outline Dimensions
Suggested Pad Layout
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
r(
t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
TAN
C
E
0.001
0.01
0.1
1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
SOT23
Dim Min Max Typ
A
0.37 0.51 0.40
B
1.20 1.40 1.30
C
2.30 2.50 2.40
D
0.89 1.03 0.915
F
0.45 0.60 0.535
G
1.78 2.05 1.83
H
2.80 3.00 2.90
J
0.013 0.10 0.05
K
0.890 1.00 0.975
K1
0.903 1.10 1.025
L
0.45 0.61 0.55
L1
0.25 0.55 0.40
M
0.085 0.150 0.110
a
8°
All Dimensions in mm
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
J
K 1
K
L 1
H
L
M
A l l 7 °
A
C
B
D
a
X
E
Y
C
Z