Diodes DMN65D8LFB - Manual (Page 2)

DMN65D8LFB
Document number: DS35449 Rev. 2 - 2
2 of 5
www.diodes.com
November 2011
© Diodes Incorporated
DMN65D8LFB
NEW PROD
UC
T
Maximum Ratings
Characteristic Symbol Value Units
Drain-Source Voltage V DSS
60 V
Gate-Source Voltage V
GSS
±20 V
Continuous Drain Current (Note 4) V
GS
= 10V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
260
210
mA
Continuous Drain Current (Note 5) V
GS
= 10V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
400
310
mA
Thermal Characteristics
Characteristic Symbol Value Units
Power Dissipation, @T
A
= 25°C (Note 4) P
D
430 mW
Thermal Resistance, Junction to Ambient @T
A
= 25°C (Note 4) R θJA 290 °C/W
Power Dissipation, @T A = 25°C (Note 5) P D
840 mW
Thermal Resistance, Junction to Ambient @T
A
= 25°C (Note 5) R θJSA 147 °C/W
Operating and Storage Temperature Range T
J
, T
STG
-55 to +150 °C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
60 - - V V
GS
= 0V, I
D
= 250
μA
Zero Gate Voltage Drain Current T
J
= 25°C I
DSS
- - 0.1 µA V
DS
= 60V, V
GS
= 0V
Gate-Body Leakage I
GSS
- - ±10 µA V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
1.2 - 2.0 V V
DS
= V
GS
, I
D
= 250 μA
Static Drain-Source On-Resistance R
DS (ON)
- -
3.0
4.0
Ω
V
GS
= 10V, I
D
= 0.115A
V GS = 5V, I D = 0.1115A
Forward Transfer Admittance |Y
fs
| 80 320 - mS V
DS
= 10V, I
D
= 0.115A
Diode Forward Voltage V
SD
- 0.7 1.2 V V
GS
= 0V, I
S
= 0.115A
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
- 25 - pF
V
DS
= 25V, V
GS
= 0V, f = 1.0MHz Output Capacitance C
oss
- 4.7 - pF
Reverse Transfer Capacitance C rss
- 2.5 - pF
Turn-On Delay Time t
D(on)
- 3.27 - ns
V
DD
= 30V, V
GEN
= 10V,
R
GEN
= 25 Ω,I
D
= 0.115A
Turn-On Rise Time t
r
- 3.15 - ns
Turn-Off Delay Time t
D(off)
- 12.025 - ns
Turn-Off Fall Time t
f
- 6.29 - ns
Notes: 4. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
5. Device mounted on 2” x 2” FR-4 PCB with high coverage 2 oz. Copper, single sided.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.