Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP1018UCB9 User Manual

Page 2

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DMP1018UCB9

Document number: DS36149 Rev. 2 - 2

2 of 6

www.diodes.com

June 2013

© Diodes Incorporated

DMP1018UCB9

ADVAN

CE I

N

F

O

RM

ATI

O

N





Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-12 V

Gate-Source Voltage

V

GSS

-6 V

Continuous Drain Current (Note 5) V

GS

= -4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-7.6
-6.0

A

Continuous Drain Current (Note 6) V

GS

= -4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-5.5
-4.3

A

Pulsed Drain Current (Pulse duration 10μs, duty cycle

1%)

I

DM

-60 A



Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 5)

P

D

1.0 W

Total Power Dissipation (Note 6)

P

D

1.8 W

Thermal Resistance, Junction to Ambient (Note 5)

R

ΘJA

126.8 °C/W

Thermal Resistance, Junction to Ambient (Note 6)

R

ΘJA

69 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

-12 - - V

V

GS

= 0V, I

D

= -250μA

Zero Gate Voltage Drain Current @T

C

= +25°C

I

DSS

- - -1

μA

V

DS

= -9.6V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

-100

nA

V

GS

= -6V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

-0.4 -0.8 -1.3 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS (ON)

-

12 18

m

V

GS

= -4.5V, I

D

= -2A

15 22

V

GS

= -2.5V, I

D

= -2A

Forward Transfer Admittance

|Y

fs

|

- 5.5 - S

V

DS

= -6V, I

D

= -2A

Diode Forward Voltage (Note 6)

V

SD

- -0.7 -1 V

V

GS

= 0V, I

S

= -2A

Reverse Recovery Charge

Q

rr

-

30.2

- nC

V

dd

= -5V, I

F

= -2A,

di/dt = 200A/µs

Reverse Recovery Time

t

rr

-

71.4

- ns

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

-

457 - pF

V

DS

= -6V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

-

272 - pF

Reverse Transfer Capacitance

C

rss

-

120 - pF

Series Gate Resistance

R

G

21.23 - 

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge (4.5V)

Q

g

-

4.9 - nC

V

GS

= -4.5V, V

DS

= -6V,

I

D

= -2A

Gate-Source Charge

Q

gs

-

0.6

- nC

Gate-Drain Charge

Q

gd

-

1.1

- nC

Turn-On Delay Time

t

D(on)

-

4.45

- ns

V

DD

= -6V, V

GS

= -4.5V,

I

DS

= -2A, R

G

= 2

,

Turn-On Rise Time

t

r

-

12.0

- ns

Turn-Off Delay Time

t

D(off)

-

100

- ns

Turn-Off Fall Time

t

f

-

93

- ns

Notes: 5.

Device mounted on FR-4 PCB with minimum recommended pad layout.

6. Device mounted on FR4 material with 1-inch

2

(6.45-cm

2

), 2-oz. (0.071-mm thick) Cu

7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.






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