Diodes DMP2033UVT - Manual (Page 2)

DMP2033UVT
Document number: DS36617 Rev. 2 - 2
2 of 5
www.diodes.com
March 2014
© Diodes Incorporated
DMP2033UVT
ADVANCED INFORMATION
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-20 V
Gate-Source Voltage V
GSS
±8 V
Continuous Drain Current (Note 6)
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-4.2
-3.4
A
Pulsed Drain Current (Note 6) I
DM
-10 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) P
D
1.2 W
Thermal Resistance, Junction to Ambient (Note 5) Steady State R
θJA
100 °C/W
Total Power Dissipation (Note 6) P
D
1.7 W
Thermal Resistance, Junction to Ambient (Note 6) Steady State R
θJA
74 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to 150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-20 ⎯ ⎯ V V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current T
J
= +25°C I
DSS
⎯ ⎯ -1.0 µA V
DS
= -20V, V
GS
= 0V
Gate-Source Leakage I
GSS
⎯ ⎯ ±100 nA V
GS
= ±8V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-0.5 — -0.9 V V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance R
DS(ON)
⎯
45 65
mΩ
V
GS
= -4.5V, I
D
= -4.2A
57 100 V
GS
= -2.5V, I
D
= -3.4A
80 200 V
GS
= -1.8V, I
D
= -2A
Forward Transfer Admittance |Y
fs
| ⎯ 9 ⎯ S V
DS
= -5V, I
D
= -4A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
⎯ 845 ⎯ pF
V
DS
= -15V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C
oss
⎯ 72 ⎯ pF
Reverse Transfer Capacitance C
rss
⎯ 63 ⎯ pF
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge
Q
g
⎯ 10.4 ⎯ nC
V
GS
= -4.5V, V
DS
= -4V,
I
D
= -3.5A
Gate-Source Charge Q
gs
⎯ 1.5 ⎯ nC
Gate-Drain Charge Q
gd
⎯ 1.9 ⎯ nC
Turn-On Delay Time t
D(on)
⎯ 6.5 ⎯ ns
V
DS
= -4V, V
GS
= -4.5V,
R
G
= 6 Ω, I
D
= -1A
Turn-On Rise Time t
r
⎯ 13.4 ⎯ ns
Turn-Off Delay Time t
D(off)
⎯ 51.5 ⎯ ns
Turn-Off Fall Time t
f
⎯ 21.8 ⎯ ns
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.