Package outline dimensions, Suggested pad layout – Diodes DMP2033UCB9 User Manual
Page 5
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DMP2033UCB9
Document number: DS35904 Rev. 3 - 2
5 of 6
www.diodes.com
June 2012
© Diodes Incorporated
DMP2033UCB9
NEW PROD
UC
T
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 12 Transient Thermal Resistance
0.001
0.01
0.1
r(t
),
T
R
ANS
IEN
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
1
R
(t) = r(t) * R
R
= 140°C/W
Duty Cycle, D = t1/ t2
θ
θ
θ
JA
JA
JA
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
Package Outline Dimensions
Suggested Pad Layout
U-WLB1515-9
Dim
Min
Max Typ
A
-
0.62 -
A2
- 0.36
0.36
A3
0.020 0.030 0.025
b
0.27 0.37 0.32
D
1.47
1.51 1.49
E
1.47
1.51 1.49
e
-
- 0.50
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.50
C1
1.00
C2
1.00
D
0.25
C
C1
C
D
C2
D
E
PIN ID
e
e
6X-Ø b
e
A2
A
SEATING PLANE
A3
e
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