Package outline dimensions, Suggested pad layout – Diodes DMP2033UCB9 User Manual

Page 5

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DMP2033UCB9

Document number: DS35904 Rev. 3 - 2

5 of 6

www.diodes.com

June 2012

© Diodes Incorporated

DMP2033UCB9

NEW PROD

UC

T




0.00001

0.0001

0.001

0.01

0.1

1

10

100

1,000

t1, PULSE DURATION TIMES (sec)

Fig. 12 Transient Thermal Resistance

0.001

0.01

0.1

r(t

),

T

R

ANS

IEN

T

T

H

E

R

MA

L

R

ES

IS

T

AN

C

E

1

R

(t) = r(t) * R

R

= 140°C/W

Duty Cycle, D = t1/ t2

θ

θ

θ

JA

JA

JA

D = 0.7

D = 0.9

D = 0.5

D = 0.3

D = 0.1

D = 0.05

D = 0.02

D = 0.01

D = 0.005

Single Pulse

Package Outline Dimensions












Suggested Pad Layout

U-WLB1515-9

Dim

Min

Max Typ

A

-

0.62 -

A2

- 0.36

0.36

A3

0.020 0.030 0.025

b

0.27 0.37 0.32

D

1.47

1.51 1.49

E

1.47

1.51 1.49

e

-

- 0.50

All Dimensions in mm

Dimensions

Value

(in mm)

C

0.50

C1

1.00

C2

1.00

D

0.25

C

C1

C

D

C2

D

E

PIN ID

e

e

6X-Ø b

e

A2

A

SEATING PLANE

A3

e

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