Electrical characteristics, Typical characteristics, Dmp21d0ufb4 – Diodes DMP21D0UFB4 User Manual

Page 3: A product line of diodes incorporated

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DMP21D0UFB4

D

atasheet number: DS35279 Rev. 3 - 2

3 of 7

www.diodes.com

February 2012

© Diodes Incorporated

DMP21D0UFB4

A Product Line of

Diodes Incorporated








Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

20 - - V

V

GS

= 0V, I

D

= -250

μA

Zero Gate Voltage Drain Current T

J

= 25°C

I

DSS

- - -1

μA

V

DS

= -20V, V

GS

= 0V

Gate-Source Leakage

I

GSS

- -

±10

μA

V

GS

= ±8V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

- -0.7 - V

V

DS

= V

GS

, I

D

= -250

μA

Static Drain-Source On-Resistance

R

DS (ON)

- -

495

m

Ω

V

GS

= -4.5V, I

D

= -400mA

690

V

GS

= -2.5V, I

D

= -300mA

960

V

GS

= -1.8V, I

D

= -100mA

Forward Transfer Admittance

|Y

fs

|

50 - - mS

V

DS

= -3V, I

D

= -300mA

Diode Forward Voltage

V

SD

- -

-1.2

V

V

GS

= 0V, I

S

= -300mA

DYNAMIC CHARACTERISTICS
Input Capacitance

C

iss

- 76.5 - pF

V

DS

= -10V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

- 13.7 - pF

Reverse Transfer Capacitance

C

rss

- 10.7 - pF

Gate Resistance

R

g

- 195 -

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge

Q

g

1.5 - nC

V

GS

= -8V, V

DS

= -15V, I

D

= -1A

Total Gate Charge

Q

g

- 1.0 - nC

V

GS

= -4.5V, V

DS

= -15V,

I

D

= -1A

Gate-Source Charge

Q

gs

- 0.2 - nC

Gate-Drain Charge

Q

gd

- 0.3 - nC

Turn-On Delay Time

t

D(on)

- 7.1 - ns

V

DS

= -10V, -I

D

= 1A

V

GS

= -4.5V, R

G

= 6

Turn-On Rise Time

t

r

- 8.0 - ns

Turn-Off Delay Time

t

D(off)

- 31.7 - ns

Turn-Off Fall Time

t

f

- 18.5 - ns

Notes:

4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate
6. Device mounted on minimum recommended pad layout test board, 10

μs pulse duty cycle = 1%.

7. Short duration pulse test used to minimize self-heating effect.



Typical Characteristics

0

0.5

1.0

1.5

2.0

0

1

2

3

4

5

Fig. 3 Typical Output Characteristic

-V

, DRAIN-SOURCE VOLTAGE (V)

DS

-I

, D

R

AI

N

C

U

R

R

EN

T

(A

)

D

V

= -1.2V

GS

V

= -1.5V

GS

V

= -2.0V

GS

V

= -2.5V

GS

V

= -3.0V

GS

V

= -4.5V

GS

V

= -4.0V

GS

V

= -1.8V

GS

0

0.5

1.0

1.5

2.0

0

0.5

1.0

1.5

2.0

2.5

3.0

-I

, D

R

AI

N

C

U

R

R

E

N

T

(A

)

D

Fig. 4 Typical Transfer Characteristic

-V

, GATE-SOURCE VOLTAGE (V)

GS

T = -55°C

A

T = 25°C

A

T = 85°C

A

T = 125°C

A

T = 150°C

A

V

= -5V

DS




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