Diodes DMG302PU - Manual (Page 2)

DMG302PU
Document number: DS36227 Rev. 2 - 2
2 of 6
www.diodes.com
May 2014
© Diodes Incorporated
DMG302PU
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-25 V
Gate-Source Voltage V
GSS
-8 V
Continuous Drain Current (Note 6) V
GS
= -4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-0.17
-0.14
A
Continuous Drain Current (Note 6) V
GS
= -2.7V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
-0.15
-0.12
A
Pulsed Drain Current T
P
≤ 300µs, Duty Cycle = 2%) I
DM
-0.5 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation
(Note 5)
P
D
0.33
W
(Note 6) 0.45
Thermal Resistance, Junction to Ambient
(Note 5)
R
θJA
376
°C/W (Note 6) 275
Thermal Resistance, Junction to Case (Note 6) R
θJC
81
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-25 ⎯ ⎯ V V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current I
DSS
⎯ ⎯ -1 µA V
DS
= -20V, V
GS
= 0V
Gate-Source Leakage I
GSS
⎯ ⎯ -100 nA V
GS
= -8V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-0.65 -0.96 -1.5 V V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance R
DS(ON)
⎯ 2.5 10
Ω
V
GS
= -4.5V, I
D
= -0.2A
⎯ 3 13 V
GS
= -2.7V, I
D
= -0.05A
Forward Transfer Admittance |Y
fs
| ⎯ 189 ⎯ ms V
DS
= -5V, I
D
= -0.2A
Diode Forward Voltage (Note 7) V
SD
⎯ ⎯ -1.5 V V
GS
= 0V, I
S
= -0.2A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
⎯ 27.2 ⎯
pF
V
DS
= -10V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C
oss
⎯ 6.1 ⎯
Reverse Transfer Capacitance C
rss
⎯ 1.7 ⎯
Total Gate Charge Q
g
⎯ 0.35 ⎯
nC
V
DS
= -5V, I
D
= -0.2A,
V
GS
= -4.5V,
Gate-Source Charge Q
gs
⎯ 0.08 ⎯
Gate-Drain Charge Q
gd
⎯ 0.06 ⎯
Turn-On Delay Time t
d(on)
⎯ 4.5 ⎯
ns
V
GS
= -4.5V, V
DD
= -6V
I
D
= -0.2A, R
G
= 50Ω
Rise Time t
r
⎯ 2.3 ⎯
Turn-Off Delay Time t
d(off)
⎯ 24.1 ⎯
Fall Time t
f
⎯ 11.0 ⎯
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.