Dmg2307l new prod uc t, Maximum ratings, Thermal characteristics – Diodes DMG2307L User Manual

Page 2: Electrical characteristics, Dmg2307l

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DMG2307L

Document number: DS35414 Rev. 3 – 2

2 of 6

www.diodes.com

November 2013

© Diodes Incorporated

DMG2307L

NEW PROD

UC

T




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 6) V

GS

= -10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-2.5
-2.0

A

Continuous Drain Current (Note 7) V

GS

= -10V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-3.8
-3.0

A

Continuous Drain Current (Note 7) V

GS

= -10V

t ≦10sec

T

A

= +25°C

T

A

= +70°C

I

D

-4.6
-3.6

A

Continuous Drain Current (Note 7) V

GS

= -4.5V

Steady

State

T

A

= +25°C

T

A

= +70°C

I

D

-3.1
-2.5

A

Pulsed Drain Current (Note 7)

I

DM

-20 A



Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 6)

P

D

0.76 W

Thermal Resistance, Junction to Ambient (Note 6)

R

θJA

159 °C/W

Total Power Dissipation (Note 7)

P

D

1.36 W

Thermal Resistance, Junction to Ambient (Note 7)

R

θJA

94 °C/W

Total Power Dissipation (Note 7) t ≦ 10sec

P

D

1.9 W

Thermal Resistance, Junction to Ambient (Note 7) t ≦ 10sec

R

θJA

65.8 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage

BV

DSS

-30

– V

V

GS

= 0V, I

D

= -250μA

Zero Gate Voltage Drain Current @T

C

= +25°C

I

DSS

– –

-1.0

μA

V

DS

= -30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

– –

±100 nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage

V

GS(th)

-1.0 – -3.0 V

V

DS

= V

GS

, I

D

= -250μA

Static Drain-Source On-Resistance

R

DS (ON)

70 90

mΩ

V

GS

= -10V, I

D

= -2.5A

105 134

V

GS

= -4.5V, I

D

= -2.5A

Forward Transfer Admittance

|Y

fs

|

4.8 – S

V

DS

= -10V, I

D

= -2.5A

Diode Forward Voltage (Note 7)

V

SD

-0.75 -1.0

V V

GS

= 0V, I

S

= -1A

DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance

C

iss

371.3

pF

V

DS

= -15V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

51.3

pF

Reverse Transfer Capacitance

C

rss

45.9

pF

Gate Resistance

R

g

17

V

DS

= 0V, V

GS

= 0V,f = 1.0MHz

Total Gate Charge (V

GS

= -4.5V)

Q

g

4.0

nC

V

GS

= -10V, V

DS

= -15V,

I

D

= -3A

Total Gate Charge (V

GS

= -10V)

Q

g

8.2

nC

Gate-Source Charge

Q

gs

0.9

nC

Gate-Drain Charge

Q

gd

1.2

nC

Turn-On Delay Time

t

D(on)

4.8

ns

V

DS

= -15V, V

GS

= -10V,

R

L

= 15Ω, R

G

= 6Ω,

I

D

= -1A

Turn-On Rise Time

t

r

7.3

ns

Turn-Off Delay Time

t

D(off)

22.4

ns

Turn-Off Fall Time

t

f

13.4

ns

Notes:

6. Device mounted on FR-4 PCB, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.

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