Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMP6250SE User Manual

Page 2

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DMP6250SE

Document Number DS36696 Rev. 1 - 2

2 of 6

www.diodes.com

January 2014

© Diodes Incorporated

DMP6250SE

ADVAN

CE I

N

F

O

RM

ATI

O

N

NEW PROD

UC

T




Maximum Ratings

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Unit

Drain-Source voltage

V

DSS

-60 V

Gate-Source voltage (Note 5)

V

GS

±20

V

Continuous Drain current (Note 6) V

GS

= -10V

T

A

= +25°C

T

A

= +70°C

I

D

-2.1
-1.7

A

T

C

= +25°C

T

C

= +70°C

I

D

-6.1
-4.9

A

Maximum Body Diode Continuous Current

I

S

-1.8 A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

I

DM

-11 A

Single Pulsed Avalanche Current (Note 7) L = 0.1mH

I

AS

-12 A

Single Pulsed Avalanche Energy (Note 7) L = 0.1mH

E

AS

8 mJ



Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

1.8

W

T

A

= +70°C

1.1

Thermal Resistance, Junction to Ambient (Note 6)

R

θJA

69 °C/W

Total Power Dissipation (Note 6)

T

C

= +25°C

P

D

14

W

Thermal Resistance, Junction to Case (Note 6)

R

θJC

8.7

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C



Electrical Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage

BV

DSS

-60

⎯

⎯

V

I

D

= -250µA, V

GS

= 0V

Zero Gate Voltage Drain Current

I

DSS

⎯

⎯

-1 µA

V

DS

= -60V, V

GS

= 0V

Gate-Source Leakage

I

GSS

⎯

⎯

±100

nA

V

GS

=

±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage

V

GS(th)

-1

⎯

-3 V

V

DS

= V

GS

, I

D

= -250µA

Static Drain-Source On-Resistance

R

DS (ON)

⎯

⎯

250

mΩ

V

GS

= -10V, I

D

= -1.0A

300

V

GS

= -4.5V, I

D

= -0.5A

Diode Forward Voltage

V

SD

⎯

⎯

-1.2 V

V

GS

= 0V, I

S

= -2.0A

DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance

C

iss

⎯

551

⎯

pF

V

DS

= -30V, V

GS

= 0V

f= 1MHz

Output Capacitance

C

oss

⎯

25.7

⎯

pF

Reverse Transfer Capacitance

C

rss

⎯

19.1

⎯

pF

Gate Resistance

R

g

⎯

12.1

⎯

Ω

V

DS

= 0V, V

GS

= 0V, f = 1MHz

Total Gate Charge (VGS = -4.5V)

Q

g

⎯

4.8

⎯

nC

V

DS

= -30V, I

D

= -2A

Total Gate Charge (VGS = -10V)

Q

g

⎯

9.7

⎯

nC

Gate-Source Charge

Q

gs

⎯

1.5

⎯

nC

Gate-Drain Charge

Q

gd

⎯

1.6

⎯

nC

Turn-On Delay Time

t

D(on)

⎯

6.3

⎯

ns

V

DS

= -30V, V

GS

= -10V,

R

G

= 50Ω, I

D

= -1A

Turn-On Rise Time

t

r

⎯

10.3

⎯

ns

Turn-Off Delay Time

t

D(off)

⎯

91.4

⎯

ns

Turn-Off Fall Time

t

f

⎯

39.8

⎯

ns

Reverse recovery time

t

rr

9.2

⎯

ns

I

S

= -1A, di/dt= 100A/µs

Reverse recovery charge

Q

rr

⎯

3.9

⎯

nC

Notes:

5. AEC-Q101 V

GS

maximum is

±16V.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.

7. IAR and EAR rating are based on low frequency and duty cycles to keep T

J

= 25°C

8. Short duration pulse test used to minimize self-heating effect.

9. For design aid only, not subject to production testing.


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