Package outline dimensions, Suggested pad layout – Diodes DMP10H400SK3 User Manual

Page 5

Advertising
background image

DMP10H400SK3

Document number: DS35932 Rev. 4 - 2

5 of 6

www.diodes.com

December 2013

© Diodes Incorporated

DMP10H400SK3

NEW PROD

UC

T




Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.






















Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.













0.00001

0.0001

0.001

0.01

0.1

1

10

100

1,000

t1, PULSE DURATION TIMES (sec)

Fig. 12 Transient Thermal Resistance

R

(t) = r(t) * R

R

= 68°C/W

Duty Cycle, D = t1/ t2

JA

JA

JA

0.001

0.01

0.1

r(t),

T

R

A

N

SI

E

N

T

T

H

E

R

MA

L

R

ES

IS

TA

N

C

E

1

D = 0.7

D = 0.9

D = 0.5

D = 0.3

D = 0.1

D = 0.05

D = 0.02

D = 0.01

D = 0.005

Single Pulse

TO252

Dim Min Max Typ

A

2.19 2.39 2.29

A1

0.00 0.13 0.08

A2

0.97 1.17 1.07

b

0.64 0.88 0.783

b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531

D

6.00 6.20 6.10

D1

5.21

e

2.286

E

6.45 6.70 6.58

E1

4.32

H

9.40 10.41 9.91

L

1.40 1.78 1.59

L3 0.88 1.27 1.08
L4 0.64 1.02 0.83

a

0° 10°

All Dimensions in mm

Dimensions

Value (in mm)

Z

11.6

X1

1.5

X2

7.0

Y1

2.5

Y2

7.0

C

6.9

E1

2.3

b3

E

2X b2

D

L4

A

c2

e

A1

L

L3

3X b

a

H

A2

E1

X2

C

Z

X1

Y1

E1

Y2

Advertising