Dmc3025lsd advanced information, Maximum ratings n-channel, Maximum ratings p-channel – Diodes DMC3025LSD User Manual

Page 2: Thermal characteristics

Advertising
background image

DMC3025LSD

Document number: DS35717 Rev. 5 - 2

2 of 9

www.diodes.com

August 2012

© Diodes Incorporated

DMC3025LSD

ADVANCED INFORMATION






Maximum Ratings N-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 5) V

GS

= 10V

Steady

State

T

A

= +25

°C

T

A

= +70

°C

I

D

6.5
5.1

A

t<10s

T

A

= +25

°C

T

A

= +70

°C

I

D

8.5
6.8

A

Continuous Drain Current (Note 5) V

GS

= 4.5V

Steady

State

T

A

= +25

°C

T

A

= +70

°C

I

D

5.3
4.1

A

t<10s

T

A

= +25

°C

T

A

= +70

°C

I

D

7.0
5.5

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

2 A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

I

DM

60 A




Maximum Ratings P-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-30 V

Gate-Source Voltage

V

GSS

±20 V

Continuous Drain Current (Note 5) V

GS

= -10V

Steady

State

T

A

= +25

°C

T

A

= +70

°C

I

D

-4.2
-3.2

A

t<10s

T

A

= +25

°C

T

A

= +70

°C

I

D

-5.5
-4.3

A

Continuous Drain Current (Note 5) V

GS

= -4.5V

Steady

State

T

A

= +25

°C

T

A

= +70

°C

I

D

-3.5
-2.3

A

t<10s

T

A

= +25

°C

T

A

= +70

°C

I

D

-4.1
-3.2

A

Maximum Continuous Body Diode Forward Current (Note 5)

I

S

-2 A

Pulsed Drain Current (10µs pulse, duty cycle = 1%)

I

DM

-30 A




Thermal Characteristics

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 6)

T

A

= +25°C

P

D

1.2

W

T

A

= +70°C

0.77

Thermal Resistance, Junction to Ambient (Note 6)

Steady State

R

θJA

104

°C/W

t<10s 62

Total Power Dissipation (Note 5)

T

A

= +25°C

P

D

1.5

W

T

A

= +70°C

0.95

Thermal Resistance, Junction to Ambient (Note 5)

Steady State

R

θJA

83

°C/W

t<10s 49

Thermal Resistance, Junction to Case (Note 5)

R

θJC

15

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.









Advertising