Dmc3025lsd advanced information, Electrical characteristics n-channel, Electrical characteristics p-channel – Diodes DMC3025LSD User Manual

Page 3: Dmc3025lsd

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DMC3025LSD

Document number: DS35717 Rev. 5 - 2

3 of 9

www.diodes.com

August 2012

© Diodes Incorporated

DMC3025LSD

ADVANCED INFORMATION




Electrical Characteristics N-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

30 —

— V

V

GS

= 0V, I

D

= 250

μA

Zero Gate Voltage Drain Current

I

DSS

1

μA

V

DS

= 30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

±1

μA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

1.0 — 2.0 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

15 20

V

GS

= 10V, I

D

= 7.4A

23 32

V

GS

= 4.5V, I

D

= 6A

Forward Transfer Admittance

|Y

fs

|

8 — S

V

DS

= 5V, I

D

= 10A

Diode Forward Voltage

V

SD

0.70 1.2 V V

GS

= 0V, I

S

= 1A

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

501 —

pF

V

DS

= 15V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

72 —

Reverse Transfer Capacitance

C

rss

57 —

Gate resistance

R

g

1.84 —

Ω

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

4.6 —

nC

V

DS

= 15V, I

D

= 10A

Total Gate Charge (V

GS

= 10V)

Q

g

9.8 —

Gate-Source Charge

Q

gs

1.6 —

Gate-Drain Charge

Q

gd

2.0 —

Turn-On Delay Time

t

D(on)

3.9 —

ns

V

DD

= 15V, V

GS

= 10V,

R

G

= 6

Ω, I

D

= 1A

Turn-On Rise Time

t

r

4.2 —

Turn-Off Delay Time

t

D(off)

16.6 —

Turn-Off Fall Time

t

f

5.8 —

Reverse Recovery Time

t

rr

5.5 —

ns

I

F

= 12A, di/dt = 500A/

μs

Reverse Recovery Charge

Q

rr

2.6 —

nC


Electrical Characteristics P-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage

BV

DSS

-30 — — V

V

GS

= 0V, I

D

= -250

μA

Zero Gate Voltage Drain Current

I

DSS

-1

μA

V

DS

= -30V, V

GS

= 0V

Gate-Source Leakage

I

GSS

±100 nA

V

GS

= ±20V, V

DS

= 0V

ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage

V

GS(th)

-1.0 — -2.0 V

V

DS

= V

GS

, I

D

= -250

μA

Static Drain-Source On-Resistance

R

DS (ON)

38 45

V

GS

= -10V, I

D

= -5.2A

65 85

V

GS

= -4.5V, I

D

= -4A

Forward Transfer Admittance

|Y

fs

|

5 — S

V

DS

= -5V, I

D

= -5.2A

Diode Forward Voltage

V

SD

-0.7 -1.2 V V

GS

= 0V, I

S

= -1A

DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance

C

iss

590 —

pF

V

DS

= -25V, V

GS

= 0V,

f = 1.0MHz

Output Capacitance

C

oss

69 —

pF

Reverse Transfer Capacitance

C

rss

53 —

pF

Gate resistance

R

g

11 —

Ω

V

DS

= 0V, V

GS

= 0V, f = 1.0MHz

Total Gate Charge (V

GS

= 4.5V)

Q

g

5.1 —

nC

V

DS

= -15V, I

D

= -6A

Total Gate Charge (V

GS

= 10V)

Q

g

10.5 —

nC

Gate-Source Charge

Q

gs

1.8 —

nC

Gate-Drain Charge

Q

gd

1.9 —

nC

Turn-On Delay Time

t

D(on)

6.8 —

ns

V

DD

= -15V, V

GS

= -10V,

R

G

= 6

Ω, I

D

= -1A

Turn-On Rise Time

t

r

4.9 —

ns

Turn-Off Delay Time

t

D(off)

28.4 —

ns

Turn-Off Fall Time

t

f

12.4 —

ns

Reverse Recovery Time

t

rr

14 —

ns

I

F

= 12A, di/dt = 500A/

μs

Reverse Recovery Charge

Q

rr

11 —

nC

Notes:

7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.

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