Diodes DMG4932LSD User Manual

Dmg4932lsd new prod uc t, Features, Mechanical data

Advertising
background image

DMG4932LSD

Document number: DS32119 Rev. 4 - 2

1 of 9

www.diodes.com

August 2010

© Diodes Incorporated

DMG4932LSD

NEW PROD

UC

T

ASYMETRICAL DUAL N-CHANNEL ENHANCEMENT MODE MOSFET

Features

High Density UMOS with Schottky Barrier Diode

Low Leakage Current at High Temp.

• High

Conversion

Efficiency

• Low

On-Resistance

Low Input Capacitance

Fast Switching Speed

Utilizes Diodes’ Monolithic DIOFET Technology to Increase
Conversion Efficiency

100% UIS and R

g

Tested

Lead Free By Design/RoHS Compliant (Note 1)

"Green" Device (Note 2)

Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case:

SO-8

Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram Below

Marking Information: See Page 8

Ordering Information: See Page 8

Weight: 0.072 grams (approximate)
















Maximum Ratings – Q1

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±12 V

Continuous Drain Current (Note 3)

Steady

State

T

A

= 25°C

T

A

= 85°C

I

D

9.5
7.2

A

Pulsed Drain Current (Note 4)

I

DM

40 A

Avalanche Current (Notes 4 & 5)

I

AR

13 A

Repetitive Avalanche Energy (Notes 4 & 5) L = 0.3mH

E

AR

25.4 mJ

Maximum Ratings – Q2

@T

A

= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

V

DSS

30 V

Gate-Source Voltage

V

GSS

±25 V

Continuous Drain Current (Note 3)

Steady

State

T

A

= 25°C

T

A

= 85°C

I

D

9.5
7.5

A

Pulsed Drain Current (Note 4)

I

DM

40 A

Avalanche Current (Notes 4 & 5)

I

AR

13 A

Repetitive Avalanche Energy (Notes 4 & 5) L = 0.3mH

E

AR

25.4 mJ

Thermal Characteristics

Characteristic Symbol

Value

Unit

Power Dissipation (Note 3)

P

D

1.19 W

Thermal Resistance, Junction to Ambient @T

A

= 25°C (Note 3)

R

θJA

107 °C/W

Operating and Storage Temperature Range

T

J

,

T

STG

-55 to +150

°C

Notes:

1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB with minimum recommended pad layout. The value in any given application depends on the user’s specific board design.
4. Repetitive rating, pulse width limited by junction temperature.
5. I

AR

and E

AR

rating are based on low frequency and duty cycles to keep T

J

= 25°C

Top View

Internal Schematic

Top View

D2

S2/D1

G1

G2

S1

D2

S2/D1

S2/D1

D

2

S

2

G

2

D

1

S

1

G

1

N-Channel MOSFET

N-Channel MOSFET

Q1

Q2

D

iodes Schottky

I

ntegrated M

O

S

FET

Advertising