Diodes MMDT4126 User Manual

Mmdt4126, Features, Mechanical data

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MMDT4126

DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

DS30160 Rev. 9 - 2

1 of 4

www.diodes.com

MMDT4126

© Diodes Incorporated

Epitaxial Planar Die Construction

Complementary NPN Type Available (MMDT4124)

Ideal for Medium Power Amplification and Switching

Ultra-Small Surface Mount Package

Lead Free/RoHS Compliant (Note 3)

"Green" Device (Note 4 and 5)

Mechanical Data

Case: SOT-363

Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).

Terminal Connections: See Diagram

Marking Information: K2B, See Page 3

Ordering & Date Code Information: See Page 3

Weight: 0.006 grams (approximate)






SOT-363

Dim

Min

Max

A

0.10

0.30

B

1.15

1.35

C

2.00

2.20

D

0.65 Nominal

F

0.30

0.40

H

1.80

2.20

J

0.10

K

0.90

1.00

L

0.25

0.40

M

0.10

0.25

α

All Dimens

mm

ions in

Maximum Ratings

@T

A

= 25°C unless otherwise specified

A

M

J

L

D

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

V

CBO

-25

V

Collector-Emitter Voltage

V

CEO

-25

V

Emitter-Base Voltage

V

EBO

-4.0

V

Collector Current – Continuous (Note 1)

I

C

-200

mA

Power Dissipation (Note 1,2)

P

d

200

mW

Thermal Resistance, Junction to Ambient (Note 1)

R

θJA

625

°C/W

Operating and Storage Temperature Range

T

j

, T

STG

-55 to +150

°C

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.


















B C

H

K

G

C

1

B

2

E

2

E

1

B

1

C

2

F

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