Diodes MMDT4146 User Manual
Mmdt4146, Features, Mechanical data
MMDT4146
Document number: DS30162 Rev. 11 - 2
1 of 5
www.diodes.com
January 2009
© Diodes Incorporated
MMDT4146
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
Complementary Pair
One 4124-Type NPN
One
4126-Type
PNP
•
Epitaxial Planar Die Construction
•
Ideal for Medium Power Amplification and Switching
•
Ultra-Small Surface Mount Package
•
Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
• Case:
SOT-363
•
Case Material: Molded Plastic, “Green” Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating) Solderable per MIL-STD-202, Method 208
•
Terminal Connections: See Diagram
•
Marking Information: See Page 4
•
Ordering Information: See Page 4
•
Weight: 0.006 grams (approximate)
Maximum Ratings, NPN 4124 Section
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V
CBO
30
V
Collector-Emitter Voltage
V
CEO
25
V
Emitter-Base Voltage
V
EBO
5.0
V
Collector Current – Continuous (Note 1)
I
C
200
mA
Maximum Ratings, PNP 4126 Section
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V
CBO
-25
V
Collector-Emitter Voltage
V
CEO
-25
V
Emitter-Base Voltage
V
EBO
-4
V
Collector Current - Continuous (Note 1)
I
C
-200
mA
Thermal Characteristics
– Total Device
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1, 2)
P
D
200
mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θJA
625
°C/W
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Top View
Device Schematic
C
2
B
1
E
1
E
2
B
2
C
1
E1, B1, C1 = PNP4126 Section
E2, B2, C2 = NPN4124 Section