Diodes MMDT5451 - Manual

MMDT5451
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Complementary Pair One 5551-Type NPN
One 5401-Type PNP
DS30171 Rev. 9 - 2 1 of 5
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MMDT5451
© Diodes Incorporated
• Epitaxial Planar Die Construction
• Ideal for Medium Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Terminal Connections: See Diagram
• Marking Information: KNM, See Page 5
• Ordering & Date Code Information: See Page 5
• Weight: 0.006 grams (approximate)
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
H 1.80 2.20
J — 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α 0° 8°
All Dimens mm ions in
A
M
J
L D
B C
H
K
G
F
C
1
B
2 E 2
E
1
B
1 C 2
E1, B1, C1 = PNP5401 Section
E2, B2, C2 = NPN5551 Section
Maximum Ratings, NPN 5551 Section
@T
A
= 25°C unless otherwise specified
Characteristic Symbol NPN5551 Unit
Collector-Base Voltage V
CBO
180 V
Collector-Emitter Voltage V
CEO
160 V
Emitter-Base Voltage V
EBO
6.0 V
Collector Current - Continuous (Note 1) I
C
200 mA
Power Dissipation (Note 1, 2) P
d
200 mW
Thermal Resistance, Junction to Ambient (Note 1) R
θJA
625 °C/W
Operating and Storage Temperature Range T
j
, T
STG
-55 to +150 °C
Maximum Ratings, PNP 5401 Section
@T
A
= 25°C unless otherwise specified
Characteristic Symbol PNP5401 Unit
Collector-Base Voltage V
CBO
-160 V
Collector-Emitter Voltage V
CEO
-150 V
Emitter-Base Voltage V
EBO
-5.0 V
Collector Current – Continuous (Note 1) I
C
-200 mA
Power Dissipation (Note 1, 2) P
d
200 mW
Thermal Resistance, Junction to Ambient (Note 1) R
θJA
625 K/W
Operating and Storage Temperature Range T
j
, T
STG
-55 to +150 °C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.