Zxtps720mc, Schottky - maximum ratings, Schottky - thermal characteristics – Diodes ZXTPS720MC User Manual

Page 4

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ZXTPS720MC

Document Number DS31938 Rev. 3 - 2

4 of 10

www.diodes.com

April 2011

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXTPS720MC








Schottky - Maximum Ratings

@ T

A

= 25°C unless otherwise specified

Parameter Symbol

Limit

Unit

Continuous Reverse Voltage

V

R

40 V

Continuous Forward Current

I

F

1.85

A

Repetitive Peak Forward Current

D = 0.5
Pulse width

≤ 300µs

I

FRM

3

Non-Repetitive Peak Forward Surge Current

t

≤ 100µs

I

FSM

12

t

≤ 10ms

7




Schottky - Thermal Characteristics

@ T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Unit

Power Dissipation
Linear Derating Factor

(Notes 10 & 13)

P

D

1.2

12

W

mW/

°C

(Notes 11 & 13)

2

20

(Notes 12 & 13)

0.9

9

(Notes 12 & 14)

1.36
13.6

Thermal Resistance, Junction to Ambient

(Notes 10 & 13)

R

θJA

83.3

°C/W

(Notes 11 & 13)

51.0

(Notes 12 & 13)

111

(Notes 12 & 14)

73.5

Thermal Resistance, Junction to Lead

(Note 15)

R

θJL

20.2

Storage Temperature Range

T

STG

-55 to +150

°C

Maximum Junction Temperature

T

J

125

Notes:

10. For a dual device surface mounted on 28mm x 28mm (8cm

2

) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device

is measured when operating in a steady-state condition. The heatsink is split in half with the exposed cathode and collector pads connected to each half.
11. Same as note (10), except the device is measured at t <5 sec.
12. Same as note (10), except the device is surface mounted on 31mm x 31mm (10cm

2

) FR4 PCB with high coverage of single sided 1oz copper.

13. For a dual device with one active die.
14. For dual device with 2 active die running at equal power.
15. Thermal resistance from junction to solder-point (on the exposed cathode pad).








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