KROHNE BM 102 EN - Manual (Page 27)

BM 102 27
Repeatability
± 2 mm or 0.08”
Hysteresis none
Resolution
± 1 mm or 0.04”
Transient recovery time The transient recovery time to 1% deviation from the final value
amounts to approximately 4.6 times the programmed time
constant. However, the transient recovery time may differ if
changes in level are very rapid.
Start-up time ≤ 23 seconds
Long term drift This is within the specified error of measurement. Allow for
thermal expansion coefficient in the case of liquids. Organic
liquids: 0.15%/K
Influence of ambient temperature
current output
HART
®
: typically 70 ppm/K
measured value 25 ppm approx. (max. deviation over total measurement range)
atmosphere -1 ppm/K (above the liquid product)
digital No influence on measured value due to regular self-calibration
Environment
Ambient temperature -30°C … +60°C or -20°F … +140°F***
Storage temperature -40°C … +80°C or -40°F … +176°F
Protection IP 65 / NEMA 4 – 4X
Shock resistance The device withstands the impact test in conformity with EN
61010, Section 8.2 with 0.5 J energy.
Vibration endurance limit IEC 68-2-6 and prEN 50178
(10-57Hz: 0.075 mm / 57-150 Hz: 1 G).
Power supply
Standard 24 V DC,
Hazardous-duty (Ex, FM, …) ≤ 28 V DC
Range 18 … 35 V DC
Process
Process temperature, product -30°C … +200°C or -22°F … +392°F * **
Process temperature, flange -30°C … +90°C or -22°F … +194°F*, option +200°C or 390°F**
Process pressure,
standard -1 … 16 bar abs. or -14.5 … 232 psig***;
max. 40 bar or 580 psig at 20°C or 45°F***
Dielectric constant εr of product measured: probe type limits
Coaxial (type 3) εr ≥ 1.4
Twin probe (type 4) εr ≥ 1.8
Single probes (types 1, 2 & 6) εr ≥ 2.1
Human interface
Communication, standard Operator control and data display via PC using PCSTAR 2
software or HART
® handheld communicator
Point-to-point 1 gauge connected to a PC or HHC
Multi-drop Up to 5 gauges connected to a PC or HHC
* see BM 102 MICROFLEX KEMA 00ATEX1101X Supplementary Installation and Operating
Instructions for Ex values (temperature classes)
** higher or lower temperatures on request (non-Ex)
*** Subject to the process temperature and the mechanical properties of the process connection