DMC TSC-30/IC - Manual (Page 21)

Document No. DER-S0098A 20 Version 1.3 ©2012 DMC Co., Ltd.
TSC-30/IC Product Specification
110

20s
175

10

C 1 to 4

C/s
220

C or higher, 50s max.
255

C or higher, 10s max.
260

C max.
Time
Pac
kage’
s s
urfac
e t
em
peratu
re
200

C or higher, 70s max.
8. Implementation Temperature Specification
We do not recommend the wave soldering method.
1. Reflow method (Infrared reflow, air reflow)
Frequency: Three times or less
Temperature: The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Soldering iron (Manual soldering)
Soldering bit ’s temperature: 370

C or lower
Soldering time: Five seconds or less/terminal