Description, Features – Samlex America SAM-3000-12 User Manual
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info
For additional technical and operational information on inverters, battery
chargers and related topics, please refer to www.samlexamerica.com under "Support"
and view "Application Notes" and/or "White Papers" section.
Description
The inverter converts 12 VDC voltage from battery or from other suitable 12 VDC source
to 115V, 60 Hz AC voltage. The waveform of the of the AC output voltage is Modified
Sine Wave.
features
• High peak efficiency of 90%
• Very high power to weight ratio - compact and light weight
• Soft Start Technology for better surge performance
• Load controlled cooling fan for better efficiency
• Cool Surface Technology for cooler and safer touch temperature
• Universal Protection circuit for low / high DC input voltage, overload / short circuit,
over temperature and Ground Fault
• Low Interference Technology for controlled RF noise
Soft Start technology
This feature offers the following advantages:
• When the inverter is switched ON, the voltage ramps up to 115 VAC in around 2 sec. If the
load was already ON at the time of switching ON of the inverter, starting surge current
demanded by certain reactive devices like motors etc. will be reduced and there will be less
likelihood of the inverter shutting down due to overload.
• If the inverter is switched ON first and then a load with higher starting / inrush current like
SMPS / motor is switched ON, the voltage will dip momentarily and will ramp up and reduce
inrush / starting surge current in the load as above
• Similar overload reduction will be initiated during any other momentary overload condition
Low interference technology
Innovative circuit design and noise filtration circuitry reduce RF interference in TV picture,
audio and radio equipment
cool Surface technology
Normally, heat dissipating components are mounted directly on internal metal chassis
surface of the inverter and hence, the chassis surface may rise to unsafe touch-tempera-
ture. In this inverter, heat-dissipating components are not mounted directly on the chassis
of the unit but on PCB (Printed Circuit Board) mounted heat sink and, there is air gap
between the heat sink and the chassis surface. The heat sink is cooled by load-controlled
fan. As there is no direct contact between the heat sink and the chassis, the chassis surface
remains much cooler and is safer to touch.
SECTION 2 |
Description, Features &
Principle of Operation
SECTION 1 |
Safety
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