Figure 16, Socket f (1207) pib board no-through-hole keep-out – AMD 1207 User Manual
Page 42
Advertising

42
Keep-Out Drawings for Platforms Using the PIB Thermal
Solution for Socket F (1207) Processors
Appendix A
32800
Rev. 3.02
August 2006
Thermal Design Guide for Socket F (1207) Processors
Figure 16.
Socket F (1207) PIB Board No-Through-Hole Keep-Out
79
4.0
36.
21
0.000
0.00
1.318
33.47
2.885
73.29
00
0.0
00.
0
44
9.1
73.
94
D
C
B
A
A
B
C
D
1
2
3
4
5
6
7
8
8
7
5
6
4
3
2
1
SE
CI
VE
D
O
R
CI
M
DE
C
N
AV
D
A
S
AX
ET
,
NI
TS
U
A
:E
LTI
T
.
O
N
.
G
W
D
VE
R
6
F
O
5
TE
EH
S
42
10
00
0Z
97
1.2
stn
en
op
mo
c
elo
h
hg
uor
ht
o
N
1A
ni
P
N
o
-T
hr
o
u
gh
-H
ol
e
C
o
m
p
o
n
e
n
ts
Z
o
ne
tu
op
ee
K
BI
P
D
MA
hti
w
tn
ail
p
mo
C
sn
oit
cirt
se
Rt
hgi
e
H
dn
a
tn
en
op
mo
Cr
os
se
cor
P)
70
21(
Ft
ek
co
S
Advertising