Rockwell Automation T8471 Trusted TMR 120V dc Digital Output Module - 32 Channel User Manual

Page 4

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Trusted

TM

Module T8471

Issue 14 Apr 10

PD-T8471

4

Table of Contents

1.

Description ...................................................................................................................................8

1.1.

Field Termination Unit (FTU) .......................................................................................................9

1.2.

Front Panel Unit (FPU) ................................................................................................................9

1.3.

Host Interface Unit (HIU) ...........................................................................................................10

1.4.

Field Interface Unit (FIU) ...........................................................................................................10

1.5.

Line monitoring and output states..............................................................................................11

1.6.

Housekeeping............................................................................................................................11

1.7.

Fault Detection/Testing..............................................................................................................11

1.8.

Sequence of Events Characteristics..........................................................................................12

1.9.

Output Switch Structure .............................................................................................................12

1.9.1.

Switch Diagnostics.....................................................................................................................13

1.9.2.

Short Circuit Protection Issues ..................................................................................................14

1.9.3.

Group Fail Safe Switches ..........................................................................................................14

2.

Installation..................................................................................................................................15

2.1.

Module Insertion/Removal .........................................................................................................15

2.2.

Cable Selection..........................................................................................................................15

2.3.

Termination................................................................................................................................15

2.4.

Module Pinout Connections .......................................................................................................16

2.5.

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Module Polarisation/Keying.......................................................................................17

3.

Application .................................................................................................................................18

3.1.

Module Configuration.................................................................................................................18

3.2.

T8471 Complex Equipment Definition .......................................................................................18

3.2.1.

Rack 1: DO ................................................................................................................................19

3.2.2.

Rack 2: STATE ..........................................................................................................................19

3.2.3.

Rack 3: AI ..................................................................................................................................20

3.2.4.

Rack 4: CI ..................................................................................................................................21

3.2.5.

Rack 5: LINE_FLT .....................................................................................................................21

3.2.6.

Rack 6: DISCREP......................................................................................................................21

3.2.7.

Rack 7: Housekeeping...............................................................................................................22

3.2.8.

Rack 8: INFO .............................................................................................................................23

3.3.

Sequence of Events Configuration ............................................................................................24

3.4.

SYSTEM.INI File Configuration .................................................................................................24

4.

Operation ...................................................................................................................................25

4.1.

Front Panel ................................................................................................................................25

4.2.

Module Status LEDs ..................................................................................................................26

4.3.

I/O Status LEDs .........................................................................................................................27

5.

Fault Finding and Maintenance..................................................................................................28

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