Cypress CY62136VN - Manual (Page 4)

CY62136VN MoBL
®
Document #: 001-06510 Rev. *A Page 4 of 12
Thermal Resistance [6]
Parameter Description Test Conditions TSOPII FBGA Unit
Θ
JA
Thermal Resistance
(Junction to Ambient) Still Air, soldered on a 4.25 x 1.125 inch,
4-layer printed circuit board 60 55
°C/W
Θ
JC
Thermal Resistance
(Junction to Case) 22 16
°C/W
AC Test Loads and Waveforms
Parameters Value Unit
R1 1105 Ohms
R2 1550 Ohms
R
TH
645 Ohms
V
TH
1.75 Volts
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions
[9]
Min. Typ.
[2]
Max. Unit
V
DR
V
CC
for Data Retention 1.0 V
I
CCDR
Data Retention Current V
CC
= 1.0V, CE > V
CC
− 0.3V,
V
IN
> V
CC
− 0.3V or V
IN
< 0.3V,
0.5 7.5
µA
t
CDR
[6]
Chip Deselect to Data
Retention Time 0 ns
t
R
[7]
Operation Recovery Time 70 ns
V
CC
Typ V
CC
OUTPUT
R2 30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT V
Equivalent to: THÉ VENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
V
CC
OUTPUT
R2 5 pF
INCLUDING
JIG AND
SCOPE
R1
Rise Time:
1 V/ns Fall Time:
1 V/ns
(a) (b)
(c)
Data Retention Waveform
Note:
7. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 ms or stable at V
CC(min)
> 100 ms.
8. No input may exceed V
CC
+ 0.3V
V
CC(min.)
V
CC(min.)
t
CDR
V
DR
> 1.0 V
DATA RETENTION MODE
t
R
CE
V
CC
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