ALTANA Mechanical Cupping Tester - Manual (Page 10)

11
English
Operation
6. Clamp the substrate in position by turning
the handles on the clamping clockwise –
hand force is sufficient.
7. There are two methods. Choose one of the
two procedures below (8 or 9).
8. Method A – Go/No Go
A pre-determined depth of deformation is
applied to the substrate in order to test for
compliance to a specification. The substrate
may or may not fail at the applied depth of
deformation. Having set the datum position
(see 7), turn both the handles (anticlockwise
as viewed from the right-hand side of the
instrument) to raise the indenter to the
depth required as shown on the LCD.
9. Method B – Failure Point
The depth of substrate deformation is
increased until the first moment cracking
and/or detachment of the coating is
observed; this marks the Failure Point,
and no further deformation is required.
Observe the deformation with standard
corrected vision or, by agreement, with the
use of the magnifying lens. The turn rate
may be reduced slightly (in order to assist
observation) at the first sign of coating
failure. Take the LCD reading at the first-
failure point.
*For both methods turn the handle at a constant rate of 0.2
±0.1 mm per second – i.e. at one revolution per second.
10. After completion, unclamp the sample (it
will be necessary to allow the clamp-ring
sufficient room for the indented-dome to be
removed).