3DLABS Oxygen RPM - Manual (Page 29)

Terms and Definitions
Chapter 4 - Glossary 21
RAMDAC: The last component in the graphics subsystem pipeline that translates
a digital image into an analog representation. This component contains a color
table RAM and the DAC that converts digital signals to analog signals (see DAC).
Rasterizer: A chip that controls the rasterization process.
Rasterization: A method to fill in colors for all pixels bound by vertices.
Refresh Frequency: The rate at which the monitor refreshes the screen. Gener-
ally quoted in Hz.
Rendering: The final and most rigorous stage in the 3D pipeline where an object
undergoes shading, texturing, etc.
RGB: Red, Green, Blue. Color information that is saved using the Red/Green/
Blue color format.
RISC: Reduced Instruction Set Computing.
SDRAM: Synchronous DRAM is a cost-effective solution to improve bandwidth
to and from memory, resulting in increased graphics performance.
SDTP: Super DeskTop Publishing. SDTP runs at a resolution of 1,600 x 1,200.
Stencil Buffer: The stencil buffer assists with the creation of effects such as
decals on the surface of an object.
Stipple masking: A technique that spatially creates transparent effects by render-
ing an object through various patterns.
SVGA: Super Video Graphics Array. SVGA runs at a resolution of 800 x 600.
Tessellation: The process of breaking parametric surfaces in the model geometry
into component polygons that can be processed by the rest of the 3D pipeline.
Although additional computation is required, rendering is more realistic when a
higher number of polygons are used to represent a surface.
Texels: Texture Elements, the name used for the smallest addressable element of a
texture map.
Texture Mapping: A technique that enables 2D graphic images to be “wrapped”
around or “pasted” on to a 3D primitive. Perspective correction and lighting calcu-
lations allow for added realism.
Transformation: The change in rotation, size and perspective of an object in 3D
space as part of the geometry operations.