Henkel Structural Bonding Solutions - Manual (Page 11)

11
Loctite ® Hysol ® 9461 A&B
• Non-sag paste
• Heat accelerated
(4 min. @ 120 °C)
• High peel strength
• Excellent low temperature
properties
Loctite ® Hysol ® 9461 A&B is a
toughened, 2K-Epoxy adhesive,
suitable for applications requiring
gap filling and high peel strength.
Ideal for bonding dissimilar
substrates like GRP, SMC and
composites.
Loctite ® Hysol ® 9464 A&B
• Non-sag paste
• Heat accelerated
(4 min. @ 120 °C)
• Fast handling strength
• Excellent low temperature
properties
Loctite ® Hysol ® 9464 A&B is a
toughened, 2K-Epoxy adhesive,
suitable for applications requiring
fast cure and high peel strength.
Ideal for bonding dissimilar
substrates like GRP, SMC and
composites.
Loctite ® Hysol ® 9514
• Suitable for induction curing
• High shear and peel strength
• Excellent chemical resistance
• High temperature resistant
(200 °C)
Loctite ® Hysol ® 9514 is a
toughened, 1K-Epoxy adhesive,
suitable for gap filling and
resistance to high operating
temperatures. Ideal for applications
requiring toughness such as filter
and magnet bonding.
Medium working life Heat curing
Gap filling
Gap filling
Fast cure
High temperature
resistant
9514 9464 A&B 9461 A&B
2K-Epoxy 2K-Epoxy 1K-Epoxy
1:1 1:1 Heat cure
100 : 100 100 : 100 Heat cure
40 min. 20 min. 5 min.
ቢ
240 min. 180 min. 30 min.
ባ
Grey Grey Grey
270 Pa.s 270 Pa.s 1,480 Pa.s
24 N/mm 2 22 N/mm 2 46 N/mm 2
10.0 N/mm 10.5 N/mm 9.5 N/mm
- 55 °C to 120 °C - 55 °C to 120 °C - 55 °C to 200 °C
50 ml dual cartridge 50 ml dual cartridge 300 ml cartridge
400 ml dual cartridge 400 ml dual cartridge 20 kg pail
1 kg tubs 1 kg tubs
20 kg pails 20 kg pails