Henkel Structural Bonding Solutions - Manual (Page 12)

12
Multi purpose
Thermally conductive
potting
Thermally conductive
9497 A&B 9492 A&B 9496 A&B
ቢ Gel time @ 120 °C
ባ Cure time @ 120 °C
Loctite ® Hysol ® 9492 A&B
• Medium viscosity
• Excellent chemical resistance
• High temperature resistant
(180 °C)
Loctite ® Hysol ® 9492 A&B is a
high operating temperature
resistant, 2K-Epoxy adhesive,
suitable for multi purpose
applications. Ideal for bonding
electronic components and mesh
to frames.
Loctite ® Hysol ® 9497 A&B
• Medium viscosity
• High thermal conductivity
• High compression strength
• High temperature resistant
(180 °C)
Loctite ® Hysol ® 9497 A&B is a
thermally conductive, 2K-Epoxy
adhesive for high temperature
filling and bonding applications.
Ideal for heat dissipation.
Loctite ® Hysol ® 9496 A&B
• Flowable
• Low shrinkage
• High thermal conductivety
Loctite ® Hysol ® 9496 A&B is a
thermally conductive, 2K-Epoxy
adhesive for low stress
applications. Ideal for potting
electronic components.
Loctite ® Hysol ®
High temperature epoxies
Your application
Room temperature curing
Description 2K-Epoxy 2K-Epoxy 2K-Epoxy
Mix ratio by volume (A : B) 2:1 6:1 2:1
Mix ratio by weight (A : B) 100 : 50 100 : 7 100 : 50
Working life 15 min. 2 hrs 2 hrs
Fixture time 75 min. 8 hrs 8 hrs
Colour White Black Grey
Viscosity 30 Pa.s 2.5 Pa.s 30 Pa.s
Shear strength (GBMS) 20 N/mm 2 17 N/mm 2 20 N/mm 2
Shear strength @ 120 °C (GBMS) 4.2 N/mm 2 6.8 N/mm 2 6 N/mm 2
Operating temperature - 55 °C to 180 °C - 55 °C to 150 °C - 55 °C to 180 °C
Pack sizes 50 ml dual cartridge 1 kg tubs 50 ml dual cartridge
400 ml dual cartridge 20 kg pails 400 ml dual cartridge
1 kg tubs 20 kg pails
20 kg pails
Solution