Document Outline

• HP ProLiant DL980 G7 Server User Guide
• Abstract
• Notice
• Contents
• Server component identification
  • Front panel components
  • Front panel LEDs
  • System Insight Display LEDs
    • Processor and memory board configuration / logical (physical) location
  • Rear panel components
  • Rear panel LEDs
  • Power supply LED
  • Fan location
  • System board components
    • System maintenance switch
  • DIMM slot locations
  • Device numbers
    • SAS hard drive LEDs
    • SAS hard drive LED combinations
  • Battery pack LEDs
• Operations
  • Power up the server
  • Power down the server
  • Extend the server from the rack
  • Remove the access panel
  • Remove the upper or lower processor memory drawer or processor memory drawer blank
  • Access the Systems Insight Display
• Setup
  • Optional installation services
  • Rack planning resources
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Rack warnings
  • Identifying the contents of the server shipping carton
  • Installing hardware options
  • Installing the server into the rack
  • Powering up and configuring the server
  • Installing the operating system
  • Registering the server
• Hardware options installation
  • Introduction
  • Processor options
    • Installing a processor
  • Memory options
    • DIMM support
    • Single-, dual-, and quad-rank DIMMs
    • DIMM identification
    • DIMM installation guidelines
    • Memory cartridge population guidelines
    • Memory subsystem architecture
    • Hemisphere mode
    • Memory performance optimization
    • Memory RAS
    • Advanced ECC memory population guidelines
    • Online Spare memory population guidelines
    • Mirrored Memory population guidelines
    • Installing memory
  • Hot-plug hard drive option
  • Redundant hot-plug power supply option
  • Internal solid state drive expansion bay option
  • Expansion board options
    • Installing a non-hot-plug expansion board
    • Installing the PCI Express I/O expansion board
    • Installing the PCI-X/PCI Express I/O expansion board
    • Low profile I/O expander
  • Battery-backed write cache module
  • FBWC module and capacitor pack option
  • HP Trusted Platform Module option
    • Retaining the recovery key/password
    • Installing the Trusted Platform Module board
    • Enabling the Trusted Platform Module
• Cabling
  • XNC cabling
  • DVD-ROM drive cabling
• Server software and configuration utilities
  • Configuration tools
    • SmartStart software
    • SmartStart Scripting Toolkit
  • HP ROM-Based Setup Utility
    • Using RBSU
    • Auto-configuration process
    • Boot options
    • BIOS Serial Console
    • Configuring lockstep memory
    • Configuring online spare memory
    • Configuring mirrored memory
  • Array Configuration Utility
  • HP Insight Control server deployment (formerly RDP)
  • Option ROM Configuration for Arrays
  • Re-entering the server serial number and product ID
  • Management tools
    • Automatic Server Recovery
    • ROMPaq utility
    • System Online ROM flash component utility
    • iLO 3 technology
    • Erase Utility
    • StorageWorks library and tape tools
    • HP Systems Insight Manager
    • Management Agents
    • Redundant ROM support
      • Safety and security benefits
    • USB support
  • Diagnostic tools
    • HP Insight Diagnostics
    • HP Insight Diagnostics survey functionality
    • Integrated Management Log
    • Array Diagnostic Utility
  • Remote support and analysis tools
    • HP Insight Remote Support software
  • Keeping the system current
    • Drivers
    • Version control
    • ProLiant Support Packs
    • Operating system version support
    • System Online ROM flash component utility
    • Change control and proactive notification
    • Care Pack
• Battery replacement
• Troubleshooting
  • Troubleshooting resources
  • Pre-diagnostic steps
    • Important safety information
      • Symbols on equipment
      • Warnings and cautions
    • Symptom information
    • Prepare the server for diagnosis
      • Performing processor procedures in the troubleshooting process
      • Breaking the server down to the minimum hardware configuration
  • Loose connections
  • Service notifications
  • Troubleshooting flowcharts
    • Start diagnosis flowchart
    • General diagnosis flowchart
    • Server power-on problems flowchart
    • POST problems flowchart
    • OS boot problems flowchart
    • Server fault indications flowchart
  • POST error messages and beep codes
    • Introduction to POST error messages
  • POST error messages and beep codes
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • Class A equipment
    • Class B equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Disposal of waste equipment by users in private households in the European Union
  • Japanese notice
  • BSMI notice
  • Korean notice
  • Chinese notice
  • Vietnam compliance marking notice
  • Ukraine notice
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
  • Acoustics statement for Germany (Geräuschemission)
  • Wireless devices
    • Brazilian notices
    • Canadian notices
    • Japanese notices
    • Taiwan notices
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Specifications
  • Environmental Specifications
  • Server Specifications
• Technical support
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Index