Texas Instruments TMS320C6202 - Manual (Page 24)

TMS320C6202
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS072B – AUGUST 1998 – REVISED AUGUST 1999
24
POST OFFICE BOX 1443
•
HOUSTON, TEXAS 77251–1443
device and development-support tool nomenclature (continued)
PREFIX DEVICE SPEED RANGE
TMS 320 C 6202 GJL –250
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-STD-883C
SM = High Rel (non-883C)
DEVICE FAMILY
320 = TMS320 family
TECHNOLOGY
–100 MHz
–150 MHz
–167 MHz
–200 MHz
–233 MHz
–250 MHz
–300 MHz
PACKAGE TYPE†
N = Plastic DIP
J = Ceramic DIP
JD = Ceramic DIP side-brazed
GB = Ceramic PGA
FZ = Ceramic CC
FN = Plastic leaded CC
FD = Ceramic leadless CC
PJ = 100-pin plastic EIAJ QFP
PQ = 132-pin plastic bumpered QFP
PZ = 100-pin plastic TQFP
PBK = 128-pin plastic TQFP
PGE = 144-pin plastic TQFP
GFN = 256-pin plastic BGA
GGU = 144-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
C = CMOS
E = CMOS EPROM
F = CMOS Flash EEPROM
DEVICE
’1x DSP:
10 16
14 17
15
’2x DSP:
25
26
’2xx DSP:
203 206 240
204 209
’3x DSP:
30
31
32
’4x DSP:
40
44
’5x DSP:
50 53
51 56
52 57
’54x DSP:
541 545
542 546
543 548
’6x DSP:
6201
6201B
6202
6203
6211
6701
6711
† DIP = Dual-In-Line Package
PGA = Pin Grid Array
CC = Chip Carrier
QFP = Quad Flat Package
TQFP = Thin Quad Flat Package
BGA = Ball Grid Array
TEMPERATURE RANGE (DEFAULT: 0
°
C TO 90
°
C)
(A)
Blank = 0 ° C to 90 ° C, commercial temperature
A = –40
°
C to 105
°
C, extended temperature
Figure 5. TMS320 Device Nomenclature (Including TMS320C6202)
ADV
ANCE INFORMA
TION