Rainbow Electronics AT84AD001B - Manual (Page 57)

57
AT84AD001B
2153C–BDC–04/04
Thermal Resistance from
Junction to Ambient The thermal resistance from the junction to ambient is 25.2 ° C/W typical.
Note: In order to keep the ambient temperature of the die within the specified limits of the
device grade (that is T
A
max = 70°C in commercial grade and 85°C in industrial grade)
and the die junction temperature below the maximum allowed junction temperature of
105°C, it is necessary to operate the dual ADC in air flow conditions (1m/s recom-
mended).
In still air conditions, the junction temperature is indeed greater than the maximum
allowed T
J
.
- T
J
= 25.2°C/W x 1.4W + T
A
= 35.28 + 70 = 105.28°C for commercial grade devices
- T
J
= 25.2°C/W x 1.4W + T
A
= 35.28 + 85 = 125.28°C for industrial grade devices
Thermal Resistance from
Junction to Board The thermal resistance from the junction to the board is 13
° C/W typical.