Surface mount information – GE Industrial Solutions EVW020A0S6R0 Series (Eighth-Brick) User Manual
Page 10
Data Sheet
March 3, 2011
EVW020A0S6R0 Series Eighth-Brick Power Modules
36–75Vdc Input; 6.0Vdc Output; 20A Output Current
LINEAGE
POWER
10
O
U
TPU
T
CUR
RE
NT,
I
O
(A
)
0
2
4
6
8
10
12
14
16
18
20
20
30
40
50
60
70
80
90
0.5 m/s
(100LFM)
NC
1.0 m/s
(200LFM)
2.0 m/s
(400LFM)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 18. Output Current Derating for the Module
with Heatplate and 0.25 in. heat sink; Airflow in
the Transverse Direction from Vout(+) to Vout(-);
Vin =48V.
O
U
TP
UT
CU
RRE
NT
, I
O
(A
)
0
2
4
6
8
10
12
14
16
18
20
20
30
40
50
60
70
80
90
0.5 m/s
(100LFM)
NC
1.0 m/s
(200LFM)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 19. Output Current Derating for the Module
with Heatplate and 0.5 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
OUT
P
UT
C
URR
E
N
T, I
O
(A
)
0
2
4
6
8
10
12
14
16
18
20
20
30
40
50
60
70
80
90
0.5 m/s
(100LFM)
NC
1.0 m/s
(200LFM)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 20. Output Current Derating for the Module
with Heatplate and 1.0 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Surface Mount Information
Pick and Place
The EVW020A0S6R0 modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o
C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
The surface mountable modules in the EVW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 22 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
EVW Bo ard
In su lato r
Solde r Ba ll
End assem bly PCB
Figure 22. Column Pin Connector Before and After
Reflow Soldering .