GE Industrial Solutions 12V Mega TLynx - Manual (Page 21)

Data Sheet
May 4, 2012 12V Mega TLynx TM : Non-Isolated DC-DC Power Modules:
6.0 – 14Vdc Input; 0.8Vdc to 3.63Vdc Output; 30A output current
LINEAGE POWER 21
Surface Mount Information
Pick and Place
The 12V Mega TLynx TM SMT modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and location of manufacture.
Figure 37. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 5 mm
max.
Bottom Side Assembly
This module is not recommended for assembly
on the bottom side of a customer board. If such
an assembly is attempted, components may fall
off the module during the second reflow process.
If assembly on the bottom side is planned, please
contact Lineage Power for special manufacturing
process instructions.
Lead-free (Pb-free) Soldering
The –Z version Mega TLynx modules are lead-free
(Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and
a SnPb soldering process
. Failure to observe the
instructions below may result in the failure of or
cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL
classification procedures. This standard provides
a recommended forced-air-convection reflow
profile based on the volume and thickness of the
package (table 4-2). The suggested Pb-free solder
paste is Sn/Ag/Cu (SAC).
Recommended linear reflow profile using Sn/Ag/Cu
solder:
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Re
fl
ow
T
em
p
(°
C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling Zone
4°C/Second
NOTE: Soldering outside of the recommended
profile requires testing to verify results and
performance.
Tin Lead Soldering
The 12V Mega TLynx TM SMT power modules are lead
free modules and can be soldered either in a lead-
free solder process or in a conventional Tin/Lead
(Sn/Pb) process. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board
assembly. The following instructions must be
observed when soldering these units. Failure to
observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.