GE Industrial Solutions 12V Mega TLynx - Manual (Page 22)

Data Sheet
May 4, 2012 12V Mega TLynx TM : Non-Isolated DC-DC Power Modules:
6.0 – 14Vdc Input; 0.8Vdc to 3.63Vdc Output; 30A output current
LINEAGE POWER 22
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o C. Typically, the eutectic solder melts at 183 o C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REF
L
O
W
T
E
MP
(°
C)
0
50
100
150
200
250
300
Preheat zone
max 4
o Cs -1
So ak zone
30-240s
Heat zo ne
max 4
o Cs -1
Peak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 38. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX
TE
MP S
O
LD
ER
(°
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 39. Time Limit Curve Above 205 o C Reflow
for Tin Lead (Sn/Pb) process.
MSL Rating
The 12V Mega TLynx TM SMT modules have a MSL
rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of <= 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).