GE Industrial Solutions PIM300X Series - Manual (Page 16)

Data Sheet
November 29, 2010
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc; 300W Input
LINEAGE POWER 16
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-
up is shown below in Figure 18.
Figure 18. Thermal Test Set-up
The thermal derating curves were generated with the
airflow parallel to the long axis of the module (input to
output).
The thermal reference points, T
ref
1 to T
ref
3 are
identified in Figure 15. For reliable operation and to
comply with the module’s safety requirements, these
temperatures should not exceed the limits specified in
the figure. Exceeding these temperatures may or may
not trigger the over temperature shutdown. The output
power of the module should not exceed the rated
input power of the module i.e. 300W.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by the module versus local ambient
temperature (T
A
) are shown in the Thermal derating
curves, Figs 13-1 to 13-4 for PIM300F and Figs 14-1
to 14-4 for PIM300A.
Manufacturing Considerations
Through-Hole Lead Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3 C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210 C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. If additional information is needed, please
consult with your Lineage Power representative for
more details.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to
Lineage Power’s
Electronics Board Mounted Power Modules: Soldering
and Cleaning Application Note (AP01-056EPS)
Air
flo w
x
Po w e r M o d ule
Wind Tunne l
PWBs
5.97_
(0.235)
76.2_
(3.0)
Pro b e Lo c a tio n
fo r m e a suring
a irflo w a nd
a m b ie nt
te m p e ra ture
25.4_
(1.0)