Post solder cleaning and drying considerations – GE Industrial Solutions Zephyr Non-Isolated SMT User Manual

Page 28

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Zephyr Non-Isolated SMT DC-DC Power Module:
0.8V to 3.5V @ 20A Output, 5V to 12V Input

LINEAGE

POWER

28

Data Sheet

March 31, 2010

MSL Rating

The Zephyr SMT modules have a MSL rating of 1.

Storage and Handling

The recommended storage environment and handling procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings
of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of

≤ 30°C and 60% relative humidity varies according to the

MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months
from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001).

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