GE Industrial Solutions HW-HC004-005-006 Series User Manual
Rohs compliant, Features, Applications
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Table of contents
Document Outline
- Features
- Applications
- Options
- Description
- Absolute Maximum Ratings
- Electrical Specifications
- Electrical Specifications (continued)
- Electrical Specifications (continued)
- Isolation Specifications
- General Specifications
- Feature Specifications
- Characteristic Curves
- Characteristic Curves (continued)
- Characteristic Curves (continued)
- Characteristic Curves (continued)
- Feature Description
- Remote On/Off
- Rtrim-down = 249.39 k
- Heat Transfer via Convection
- Figure 68. EMC signature using above filter, HW005A0F.
- Mechanical Outline for HW/HC Surface-Mount Module
- Mechanical Outline for HW/HC Through Hole Module
- Recommended Pad Layout for Surface Mount and Through Hole Module
- Packaging Details
- Through-Hole Lead-Free Soldering Information
- Packaging Details
- Figure 69. Surface Mount Packaging Tray
- Pick and Place
- Nozzle Recommendations
- Reflow Soldering Information
- Figure 72. Recommended Reflow Profile
- Figure 73. Time Limit Curve Above 205oC Reflow .
- Post Solder Cleaning and Drying Considerations
- The cleanliness designator of the open frame power module is C00 (per J specification).
- Ordering Information