Ampro Corporation 486E - Manual (Page 13)

Introduction
1–5
Modular PC/104 Expansion Bus
The Little Board/486e CPU provides a PC/104-compatible expansion bus for additional system
functions. This bus is a compact version of the standard PC ISA bus and offers compact, self-
stacking, modular expandability. The growing list of PC/104 modules available from Ampro and
other PC/104 vendors includes such functions as:
! Communications interfaces
! Video frame grabbers
! Field bus interfaces
! Digital signal processors (DSPs)
! Data acquisition and control functions
! Many specialized interfaces and controllers
In addition, customized, application-specific logic boards can be stacked on top of the
Little Board/486e CPU using the PC/104 expansion bus interface as a rugged and reliable
interconnect. The PC/104 bus is an embedded system version of the signal set provided on a
desktop PC’s ISA bus.
Enhanced Reliability
Ampro specializes in producing highly reliable embedded system computers and peripherals
capable of withstanding hostile, mission-critical environments without operator intervention.
Ampro’s system designs and a comprehensive testing program have evolved to ensure a reliable
and stable system for use in these harsh and demanding applications.
ISO 9001 Manufacturing. Ampro is a certified ISO 9001 vendor.
Regulatory testing. Knowing that many embedded systems must qualify under EMC emissions
susceptibility testing, Ampro designs boards with careful attention to EMI issues. Boards are
tested in standard enclosures to ensure that they can pass such emissions tests. Tests include the
following CE MARK European Union directives:
! EN55022 and EN55011 (for EMC)
! EN61000-4-2 (for ESD)
! EN61000-4-6 (for RF Susceptibility)
! EN61000-4-4 (For EFT)
Tests also include emissions testing at US voltages per FCC Part 15, Subpart J. The test levels are
CISPR Class A / VCCI1, Light Industrial.
Wide-range temperature testing. Ampro Engineering qualifies all of its designs by extensive
thermal and voltage margin testing.
3.3V CPU for greater high temperature tolerance. The board uses the latest low-voltage CPU
technology to extend its temperature range and reduce cooling requirements.
Shock and Vibration Testing. Boards intended for use in harsh environments are designed for
shock and vibration durability to MIL-STD 202F, Method 214A, Table 214I, Condition D at 5
minutes per axis for random vibration, and to MIL-STD 202F, Method 213B, Table 213-1,
Condition A for resistance to mechanical shock.