Rockwell Automation 1779-KP5_KP5R ORD.1779-5.3 - Manual (Page 14)

Chapter
3
3Ć1
Installing the 1779ĆKP5 Module
This chapter provides procedures for:
Mounting the 1779-KP5
Setting the Data Highway II Node Address for the 1779-KP5
Setting Option Switches on the 1779-KP5
Connecting Communication Cables to the 1779-KP5
Connecting Power and Ground to the 1779-KP5
Powering Up the 1779-KP5
You mount the 1779-KP5 in an enclosure. The temperature of the air at
any point directly below the module must not exceed 60
o C (140 o F).
Otherwise, the failure rate of semiconductor devices may increase
significantly.
The temperature tends to be higher toward the top of the enclosure. In
addition, the following factors affect the temperature in an enclosure:
The Size of the Enclosure (Smaller enclosures heat up faster.)
How Much Heat Is Being Dissipated in the Enclosure
The Temperature of the Air Surrounding the Enclosure
Heat dissipation includes not only the heat dissipated through the power
supplies for your equipment but also the heat dissipated through input and
output circuits.
To allow necessary air flow for cooling of components, refer to the
example shown in Figure 3.1 and follow these rules:
Provide six inches minimum vertical separation and four inches
horizontal separation between components.
Provide six inches minimum vertical separation between a chassis and
the top or bottom of the enclosure.
Provide four inches minimum horizontal separation between chassis
and to enclosure sides.
If you have excess space in the enclosure, leave it at the top of the
enclosure where the temperature is higher.
Mount wiring ducts, taps, and terminal strips no closer than two inches
from any chassis.
Chapter Objectives
Guidelines for Mounting the
1779ĆKP5